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8 Layer 1.7mm FR4 TG170 Industrial Control PCBA

MOQ:	1
Payment Terms:	T/T
Supply Ability:	Post-soldering 700,000 points/day

Detail Information

Product Description

Detail Information

Certification:

ISO, UL, IPC, Reach

Layer:

10 Layer

Material:

FR4 Tg180

Thickness:

2.0mm±10%

Pin Space:

0.2mm

Min. Component Size:

01005

Assembly Process:

SMT+DIP

PCBA Test:

X-ray,AOI Test,Functional Test

Application:

LiDAR

Supply Ability:

Post-soldering 700,000 points/day

Highlight:

8 layer FR4 industrial PCBA

1.7mm TG170 control PCBA

industrial control PCBA with warranty

Product Description

8 Layer 1.7mm FR4 TG170 Industrial Control PCBA

What Is Industrial Control PCBA?

Industrial Control PCBA is a specialized printed circuit board assembly designed for industrial control applications. It is used to build critical components such as control panels, programmable logic controllers (PLCs), and motor drives in industrial systems.

Features of Industrial-grade Laser Radar PCBA

High precision: Fine line layout ensures accurate detection
High speed: Supports fast scanning with real-time generation of three-dimensional data
Strong reliability: Anti-interference design enables 7×24 hours stable operation
Multi-layer board: Optimized wiring reduces signal interference
Anti-electromagnetic interference: Multiple filtering protection with EMC certification

Applications

Manufacturing Automation: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment for high-precision production
Robotics: Industrial robotic arms, AGV carts, collaborative robots for movement and interaction control
Energy and Power: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS)
Petrochemical/Metallurgy: Pumping units, reactor controls, rolling mill equipment for high temperature and high pressure environments

Technical Parameters

Item	Normal	Special
SMT Assembly	PCB Specification
	*Length and Width (LW)**
	Minimum	L≥3mm, W≥3mm	L＜2mm
	Maximum	L≤800mm, W≤460mm	L＞1200mm, W＞500mm
	Thickness (T)
	Thinnest	0.2mm	T＜0.1mm
	Thickest	4mm	T＞4.5mm
SMT Components Specification	Outline Dimension
	Min size	0201 (0.6mm*0.3mm)	01005 (0.3mm*0.2mm)
	Max size	200 * 125	200 * 125
	Component thickness	T≤15mm	6.5mm＜T≤15mm
	QFP,SOP,SOJ (multi pins)
	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
CSP/BGA
	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB Specification
	*Length and Width (LW)**
	Minimum	L≥50mm, W≥30mm	L＜50mm
	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
	Thickness (T)
	Thinnest	0.8mm	T＜0.8mm
	Thickest	3.5mm	T＞2mm