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12 Layer 3OZ High Density Interconnect HDI PCB
♦ What is High Density PCB (HDI PCB)?
A High Density Interconnect (HDI) PCB is an advanced printed circuit board designed to accommodate more components in a smaller space by using finer traces, smaller vias, and higher connection density than traditional PCBs. HDI technology enables miniaturization, improved signal integrity, and enhanced performance in modern electronics.
♦ Key Features of HDI PCBs:
✅ Finer Trace Width/Spacing (≤ 100µm, vs. standard 150µm+).
✅ Microvias (laser-drilled, < 150µm diameter) for high-density interconnects.
✅ Blind & Buried Vias (instead of through-hole vias) to save space.
✅ Thinner Dielectric Materials (for compact layer stacking).
✅ Higher Layer Count (often 8+ layers in a slim profile).
✅ Advanced Materials (low-loss dielectrics for high-speed signals).
♦ HDI PCB vs. Standard PCB: Key Differences?
| Feature | HDI PCB | Standard PCB |
|---|---|---|
| Trace Width | ≤ 100µm (can go down to 40µm) | ≥ 150µm |
| Via Size | Microvias (50–150µm) | Through-hole vias (≥ 300µm) |
| Via Types | Blind, buried, stacked | Mostly through-hole |
| Layer Count | 8+ (with thin dielectrics) | Typically 2–12 layers |
| Signal Speed | Optimized for high-speed signals | Limited high-speed performance |
| Applications | Smartphones, wearables, aerospace | Consumer electronics, power circuits |
♦ Types of HDI PCBs:
♦ Technical Parameters
|
Item |
Spec |
|
Layers |
1~64 |
|
Board Thickness |
0.1mm-10 mm |
|
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
|
Max Panel Size |
800mm×1200mm |
|
Min Hole Size |
0.075mm |
|
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
|
Board Outline Tolerance |
士0.10mm |
|
Insulation Layer Thickness |
0.075mm--5.00mm |
|
Out Layer Copper Thickness |
18um--350um |
|
Drilling Hole (Mechanical) |
17um--175um |
|
Finish Hole (Mechanical) |
17um--175um |
|
Diameter Tolerance (Mechanical) |
0.05mm |
|
Registration (Mechanical) |
0.075mm |
|
Aspect Ratio |
17:01 |
|
Solder Mask Type |
LPI |
|
SMT Min. Solder Mask Width |
0.075mm |
|
Min. Solder Mask Clearance |
0.05mm |
|
Plug Hole Diameter |
0.25mm--0.60mm |