DQS Electronic Co., Limited
|
| MOQ: | 1 |
| Betalingsvoorwaarden: | T/T |
| Toeleveringsvermogen: | 700.000 punten/dag na het solderen |
| PCB Assemblage Capaciteit | Normaal | Speciaal |
|---|---|---|
| SMT Assemblage | ||
| PCB Specificatie - Lengte en Breedte (L*B) | Minimum: L≥3mm, B≥3mm Maximum: L≤800mm, B≤460mm |
L＜2mm L＞1200mm, B＞500mm |
| Dikte (T) | Dunste: 0.2mm Dikte: 4mm |
T＜0.1mm T＞4.5mm |
| SMT Componenten Specificatie - Omtrek Afmeting | Min. grootte: 0201(0.6mm*0.3mm) Max. grootte: 200*125 |
01005(0.3mm*0.2mm) 200*125 |
| Component Dikte | T≤15mm | 6.5mm＜T≤15mm |
| QFP, SOP, SOJ (multi pins) - Min. pinruimte | 0.4mm | 0.3mm≤Pitch＜0.4mm |
| CSP/BGA - Min. balruimte | 0.5mm | 0.3mm≤Pitch＜0.5mm |
| DIP Assemblage | ||
| PCB Specificatie - Lengte en Breedte (L*B) | Minimum: L≥50mm, B≥30mm Maximum: L≤1200mm, B≤450mm |
L＜50mm L≥1200mm, B≥500mm |
| Dikte (T) | Dunste: 0.8mm Dikte: 3.5mm |
T＜0.8mm T＞2mm |
