| MOQ: | 1 |
| Payment Terms: | T/T |
| Supply Ability: | Post-soldering 700,000 points/day |
| PCB Assembly Capability | Normal | Special |
|---|---|---|
| SMT Assembly | ||
| PCB Specification - Length and Width (L*W) | Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm |
L<2mm L>1200mm, W>500mm |
| Thickness (T) | Thinnest: 0.2mm Thickest: 4mm |
T<0.1mm T>4.5mm |
| SMT Components Specification - Outline Dimension | Min size: 0201(0.6mm*0.3mm) Max size: 200*125 |
01005(0.3mm*0.2mm) 200*125 |
| Component Thickness | T≤15mm | 6.5mm<T≤15mm |
| QFP, SOP, SOJ (multi pins) - Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm |
| CSP/BGA - Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm |
| DIP Assembly | ||
| PCB Specification - Length and Width (L*W) | Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm |
L<50mm L≥1200mm, W≥500mm |
| Thickness (T) | Thinnest: 0.8mm Thickest: 3.5mm |
T<0.8mm T>2mm |