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2 Layer 0.35mm 3OZ Flexible PCB Board for DNA Sequencer

2 Layer 0.35mm 3OZ Flexible PCB Board for DNA Sequencer

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Detail Information

Product Description

Detail Information

Layer:

2 Layer

Board Thickness:

0.35m

Board Material:

Polyimide (PI)

Finished Copper:

0.3 OZ

Min Line Width/Spacing:

0.1/0.1mm

Surface Finish:

ENIG/OSP/Immersion Silver

Application:

DNA Sequencer

Certificate:

UL,IATF16949,ISO&Reach

Highlight:

2 layer flexible PCB board

0.35mm flexible PCB for DNA sequencer

3OZ flexible PCB with warranty

Product Description

2 Layer 0.35mm 3OZ Flexible PCB Board for DNA Sequencer

Flexible PCB (FPC), also known as flexible circuit or "soft board," is a specialized printed circuit board manufactured using flexible insulating materials such as polyimide (PI) or polyester (PET) instead of rigid fiberglass (FR4). This unique construction enables FPCs to bend, fold, and twist without damage, facilitating compact, lightweight, and space-efficient designs in modern electronic applications.

Key Advantages of Flexible PCBs

Lightweight and portable: Thin profile and reduced weight save equipment space and overall system weight
Flexible and bendable: Capable of bending and folding to accommodate complex structural designs
Durable construction: Resistant to repeated bending with extended service life
Signal stability: Minimizes transmission interference for reliable high-speed data transfer
High integration: Supports dense circuit and component arrangement with integrated functionality

Manufacturing Challenges in Flexible PCB Production

Fragile base material: Thin PI film is prone to wrinkling and cracking, requiring low-tension precision processing
Micro-line control difficulties: Micron-level line width/spacing presents challenges in electroplating and hole filling processes
Strict alignment requirements: Multi-layer lamination demands high precision to prevent yield-reducing offsets
Surface sensitivity: Plating must balance flexibility with conductivity within narrow process windows
Complex inspection procedures: Internal line defects require detection using specialized equipment like X-ray systems

Industry Applications

Smartphones & Wearables (foldable screens, flexible displays)
Laptops & Tablets (hinge connections, battery flex cables)
Automotive Electronics (sensors, lighting, dashboard controls)
Medical Devices (implantable electronics, diagnostic equipment)
Aerospace & Defense (lightweight, high-reliability circuits)

Technical Specifications

Parameter	Specification
Layers	1~64
Board Thickness	0.1mm-10mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	±0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm