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8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board

8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board

MOQ: 1
Price: Inquiry Us
Payment Terms: T/T
Detail Information
Layer:
8 Layer
Base Material:
FR4 TG170
Min. Component Size:
0201
PCB Thickness:
1.5mm
Pin Space:
0.1mm
Surface Finish:
Immersion Gold
Testing Method:
Flying Probe, ICT, Functional Test,AOI
Application:
Smart Home Main Board
Highlight:

8 layer FR4 PCBA board

,

TG170 ENIG smart home PCBA

,

electronic PCBA main board

Product Description
8 Layer FR4 TG170 ENIG Electronic PCBA for Smart Home Main Board
What is ENIG PCBA?

ENIG PCBA refers to a printed-circuit board assembly where the bare board is finished with ENIG (Electroless Nickel Immersion Gold) surface treatment. This process applies a two-layer metallic coating:

  • 3-6 µm of electroless nickel plating directly on copper pads, serving as a diffusion barrier and solderable surface
  • 0.05-0.15 µm of immersion gold deposited on top of the nickel to prevent oxidation and maintain a flat, wire-bondable/solderable surface

Due to its exceptional planarity and corrosion resistance, ENIG PCBA is widely used in high-reliability applications including smartphones, aerospace systems, medical equipment, and telecommunications devices.

DQS PCB Assembly Capabilities
SMT Assembly Specifications
Specification Normal Special
PCB Dimensions (L×W) Min: L≥3mm, W≥3mm
Max: L≤800mm, W≤460mm
L<2mm
L>1200mm, W>500mm
PCB Thickness (T) Thinnest: 0.2mm
Thickest: 4mm
T<0.1mm
T>4.5mm
SMT Components Min: 0201 (0.6mm×0.3mm)
Max: 200×125
Thickness: T≤15mm
01005 (0.3mm×0.2mm)
200×125
6.5mm<T≤15mm
QFP/SOP/SOJ Pin Spacing Minimum: 0.4mm 0.3mm≤Pitch<0.4mm
CSP/BGA Ball Spacing Minimum: 0.5mm 0.3mm≤Pitch<0.5mm
DIP Assembly Specifications
Specification Normal Special
PCB Dimensions (L×W) Min: L≥50mm, W≥30mm
Max: L≤1200mm, W≤450mm
L<50mm
L≥1200mm, W≥500mm
PCB Thickness (T) Thinnest: 0.8mm
Thickest: 3.5mm
T<0.8mm
T>2mm
One-Stop Electronic Manufacturing Services
PCB Prototype
Quick Turn PCB
Single-Sided PCB
Double-Sided PCB
Multilayer PCB
Rigid PCB
Flexible PCB
Rigid-Flex PCB
Aluminum PCB
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BGA PCB
High TG PCB
PCB Stencil
Impedance Control PCB
PCB Assembly
High-Frequency PCB
Bluetooth Circuit Board
Automotive PCB
USB Circuit Board
Halogen-Free PCB
Antenna PCB
Core Competencies
SMT Technology
8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board 0
  • 13 automatic high-speed SMT lines
  • 5 million points per day capacity
  • FPC/Double sided mounting capability
  • Automatic conformal coating
DIP Assembly
8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board 1
  • 4 dedicated DIP lines
  • 700,000 post-soldering points per day
  • Professional DIP plug-in team
Advanced SMT Capabilities
8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board 2
  • Minimum component package: 01005
  • Minimum pin spacing: 0.3mm
  • Minimum BGA pitch: 0.3mm
PCBA OEM Services
8 Layer Fr4 TG170 ENIG Electronic PCBA for Smart Home Main Board 3
  • Full turnkey PCB assembly solutions
  • Partial turnkey PCB assembly options