FR4 Material HDI Printed Circuit Boards For Electronic Smart Watch

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xApplication | Consumer Electronics | Product Name | Printed Circuit Board |
---|---|---|---|
Material | FR4 | ||
High Light | FR4 HDI Printed Circuit Boards,Smart Watch HDI Printed Circuit Boards,HDI Electronic Printed Circuit Boards |
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What is HDI PCB?
An HDI PCB is a multilayer circuit board with microvia diameter within 5mil (0.127mm), line space/width of inner and outer circuit layers within 4mil (0.10mm), and PCB pad diameter within 0.35mm. For HDI PCBs, microvias can be single microvias, staggered vias, stacked vias, and skip vias, and because of microvias, HDI PCBs are also known as microvia PCBs. HDI PCB features blind microvias, fine traces, and sequential lamination manufacturing.
If you don't know the mentioned PCB vias for HDI PCBs, please refer to this post: 8 Types of PCB vias - A Complete Guide of PCB Vias in 2021.
HDI PCBs are usually classified by the HDI builds, and there are the 1+N+1, 2+N+2, 3+N+3, 4+N+4, and 5+N+5. In the HDI PCB's outer layers, microvias usually form the more expensive stacked vias or cheaper staggered vias.
HDI PCB:
High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.
Advantages of HDI PCB
The most common reason for using HDI technology is a significant increase in packaging density.
The space obtained by finer track structures is available for components.
Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing.
HDI technology makes routing and connection easy, especially when routing between pins.
Parameters
- Layers: 12
- Base Material:FR4 High Tg EM827
- Thickness:1.2±0.1mm
- Min.Hole Size:0.15mm
- Minimum Line Width/Space:0.075mm/0.075mm
- Minimum Clearance between Inner Layer PTH and Line: 0.2mm
- Size:101mm×55mm
- Aspect Ratio:8 : 1
- Surface treatment:ENIG
- Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
- Applications:Telecommunication
YScircuit HDI PCB manufacturing capabilities overview | |
Feature | capabilities |
Layer Count | 4-60L |
Available HDI PCB Technology | 1+N+1 |
2+N+2 | |
3+N+3 | |
4+N+4 | |
5+N+5 | |
Any layer | |
Thickness | 0.3mm-6mm |
Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) |
BGA PITCH | 0.35mm |
Min laser Drilled Size | 0.075mm(3nil) |
Min mechanical Drilled Size | 0.15mm(6mil) |
Aspect Ratio for laser hole | 0.9:1 |
Aspect Ratio for through hole | 16:1 |
Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. |
Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over |
Copper filled, silver filled | |
Laser via copper plated shut | |
Registration | ±4mil |
Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |
layer/m² | S<1㎡ | S<3㎡ | S<6㎡ | S<10㎡ | S<13㎡ | S<16㎡ | S<20㎡ | S<30㎡ | S<40㎡ | S<50㎡ | S<65㎡ | S<85㎡ | S<100㎡ |
1L | 4wds | 6wds | 7wds | 7wds | 9wds | 9wds | 10wds | 10wds | 10wds | 12wds | 14wds | 15wds | 16wds |
2L | 4wds | 6wds | 9wds | 9wds | 11wds | 12wds | 13wds | 13wds | 15wds | 15wds | 15wds | 15wds | 18wds |
4L | 6wds | 8wds | 12wds | 12wds | 14wds | 14wds | 14wds | 14wds | 15wds | 20wds | 25wds | 25wds | 28wds |
6L | 7wds | 9wds | 13wds | 13wds | 17wds | 18wds | 20wds | 22wds | 24wds | 25wds | 26wds | 28wds | 30wds |
8L | 9wds | 12wds | 15wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
10L | 10wds | 13wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
12L | 10wds | 15wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
14L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds | 30wds |
16L | 10wds | 16wds | 17wds | 18wds | 20wds | 20wds | 22wds | 24wds | 26wds | 27wds | 28wds | 30wds |
30wds |
FQA
What is HDI PCBs?
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.
Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.
A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
1.Multi-step HDI enables the connection between any layers;
2.Cross-layer laser processing can enhance the quality level of multi-step HDI;
3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.