FR4 Material HDI PCB Board , High Precision Circuit Board For Electronic Products

Shenzhen Electronic Products PCBA Board High Precision Circuit Board HDI PCB

What is HDI PCB

Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.

HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.

HDI PCB:

High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Parameters

• Layers: 12
• Base Material:FR4 High Tg EM827
• Thickness:1.2±0.1mm
• Min.Hole Size:0.15mm
• Minimum Line Width/Space:0.075mm/0.075mm
• Minimum Clearance between Inner Layer PTH and Line: 0.2mm
• Size:101mm×55mm
• Aspect Ratio:8 : 1
• Surface treatment:ENIG
• Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
• Applications:Telecommunication

FQA

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.