Electronics HDI Custom Multilayer PCB With HASL ENIG Surface Finishing

Shenzhen Electronics HDI PCB Processing Circuit Board Customized Multilayer PCB

What is HDI PCB?

HDI PCBs are described by high-density features comprising of laser micro-vias, high performance thin materials and fine lines. The better density allows extra functions per unit area. These types of multifaceted structures give the required routing resolution for large pin-count chips which are used in mobile devices and other high technology products.

The placement of the parts on the circuit board needs extra precision than conservative board design due to miniature pads and fine pitch of the circuitry on the circuit board. Leadless chips require special soldering methods and additional steps in the assembly and repair process.

The lesser weight and size of the HDI circuitry means the PCBs fit into the little spaces and have a smaller amount of mass than conservative PCB designs. The smaller weight and size even signifies that there is lesser chance of harm from mechanical

HDI PCB:

High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Parameters

• Layers: 12
• Base Material:FR4 High Tg EM827
• Thickness:1.2±0.1mm
• Min.Hole Size:0.15mm
• Minimum Line Width/Space:0.075mm/0.075mm
• Minimum Clearance between Inner Layer PTH and Line: 0.2mm
• Size:101mm×55mm
• Aspect Ratio:8 : 1
• Surface treatment:ENIG
• Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
• Applications:Telecommunication

FQA

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.