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Industrial HDI PCB Board , Custom Made Circuit Boards With Provided Gerber Files
| Place of Origin | Shenzhen |
|---|---|
| Brand Name | YScircuit |
| Certification | ISO9001,UL,REACH, RoHS |
| Model Number | YS-HDI-0023 |
| Minimum Order Quantity | 1 piece |
| Price | 0.04-5$/piece |
| Packaging Details | Foam cotton + carton + strap |
| Delivery Time | 2-8 days |
| Payment Terms | T/T，PayPal, Alibaba pay |
| Supply Ability | 251,000 square meter/year |
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xProduct Details
| Material | FR4 | Size | According To Customer Request |
|---|---|---|---|
| Process | Immersion Gold/sliver | Surface Finishing | HASL/HASL-LF |
| Copper Thickness | 1oz | Base Material | FR-4 |
| High Light | Industrial HDI PCB Board,Custom HDI PCB Board,HDI Custom Made Circuit Boards |
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Product Description
Custom Made Hdi PCB Printer Clone PCB Manufacturing With Provided Gerber Files
What is HDI PCB
HDI PCB:
High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.
Advantages of HDI PCB
The most common reason for using HDI technology is a significant increase in packaging density.
The space obtained by finer track structures is available for components.
Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing.
HDI technology makes routing and connection easy, especially when routing between pins.
Parameters
- Layers: 12
- Base Material:FR4 High Tg EM827
- Thickness:1.2±0.1mm
- Min.Hole Size:0.15mm
- Minimum Line Width/Space:0.075mm/0.075mm
- Minimum Clearance between Inner Layer PTH and Line: 0.2mm
- Size:101mm×55mm
- Aspect Ratio:8 : 1
- Surface treatment:ENIG
- Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
- Applications:Telecommunication
| YScircuit HDI PCB manufacturing capabilities overview | |
| Feature | capabilities |
| Layer Count | 4-60L |
| Available HDI PCB Technology | 1+N+1 |
| 2+N+2 | |
| 3+N+3 | |
| 4+N+4 | |
| 5+N+5 | |
| Any layer | |
| Thickness | 0.3mm-6mm |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) |
| BGA PITCH | 0.35mm |
| Min laser Drilled Size | 0.075mm(3nil) |
| Min mechanical Drilled Size | 0.15mm(6mil) |
| Aspect Ratio for laser hole | 0.9:1 |
| Aspect Ratio for through hole | 16:1 |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over |
| Copper filled, silver filled | |
| Laser via copper plated shut | |
| Registration | ±4mil |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. |
FQA
What is HDI PCBs?
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.
Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.
A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
1.Multi-step HDI enables the connection between any layers;
2.Cross-layer laser processing can enhance the quality level of multi-step HDI;
3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.
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