1oz Copper Thick HDI PCB Board FR4 Material For Electronic Car

Consumer Electronics Prototype Printed Circuit Board HDI PCB Board For E-Car

What is HDI PCB?

HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.

HDI PCBs are described by high-density features comprising of laser micro-vias, high performance thin materials and fine lines. The better density allows extra functions per unit area. These types of multifaceted structures give the required routing resolution for large pin-count chips which are used in mobile devices and other high technology products.

HDI PCB:

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density.

The space obtained by finer track structures is available for components.

Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing.

HDI technology makes routing and connection easy, especially when routing between pins.

FQA

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.