Double Side HDI PCB Board Assembly With Immersion Gold Sliver Process

Pcb Board Circuit Assembly & Other Boards Double-Sided Hdi Pcba

What is HDI PCB?

Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
HDI PCB:

High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density.

The space obtained by finer track structures is available for components.

Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing.

HDI technology makes routing and connection easy, especially when routing between pins.

Parameters

• Layers: 12
• Base Material:FR4 High Tg EM827
• Thickness:1.2±0.1mm
• Min.Hole Size:0.15mm
• Minimum Line Width/Space:0.075mm/0.075mm
• Minimum Clearance between Inner Layer PTH and Line: 0.2mm
• Size:101mm×55mm
• Aspect Ratio:8 : 1
• Surface treatment:ENIG
• Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole
• Applications:Telecommunication

FQA

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market.

Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.