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4 Layer HASL FR4 TG150 1.6 mm PCB Assembly Service for Industrial Control

MOQ:	1
Condizioni di pagamento:	T/T
Capacità di approvvigionamento:	700.000 punti/giorno per la post-saldatura

Informazione dettagliata

Descrizione di prodotto

Informazione dettagliata

Certificazione:

ISO, UL, IPC, Reach

Strato:

4 strati

Materiale:

FR4 TG150

Spessore:

20,0 mm±10%

Spazio per pin:

0,2 mm

Min. Component Size:

01005

Processo di assemblaggio:

SMT+DIP

Test PCBA:

RAY, test AOI, test funzionale

Applicazione:

Controllo industriale

Capacità di alimentazione:

700.000 punti/giorno per la post-saldatura

Evidenziare:

4 layer FR4 PCB assembly service

HASL TG150 industrial control PCB

1.6mm thick industrial PCBA

Descrizione di prodotto

4 Layer HASL FR4 TG150 1.6 mm PCB Assembly Service for Industrial Control

4 Layer HASL FR4 TG150 1.6 mm PCB Assembly Service for Industrial Control

What Is Industrial Control PCBA?

Industrial Control PCBA is a specialized printed circuit board assembly designed for industrial control applications. It is used to build critical components such as control panels, programmable logic controllers (PLCs), and motor drives in industrial systems.

Features of Industrial-grade Laser Radar PCBA

High precision: fine line layout to ensure accurate detection
High speed: support fast scanning, real-time generation of three-dimensional data
Strong reliability: anti-interference design, 7×24 hours stable operation
Multi-layer board: optimize wiring, reduce signal interference
Anti-electromagnetic interference: multiple filtering protection, passed EMC certification

Applications

Manufacturing Automation: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment, etc., to achieve high-precision production
Robots: Industrial robotic arms, AGV carts, collaborative robots, etc., to control movement and interaction
Energy and Power: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS), etc.
Petrochemical/Metallurgy: Pumping units, reactor controls, rolling mill equipment, etc., to adapt to high temperature and high pressure environments

Technical Parameters

PCB Assembly Capability

Item	Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)
		Minimum: L≥3mm, W≥3mm	L＜2mm
		Maximum: L≤800mm, W≤460mm	L＞1200mm, W＞500mm
	Thickness( T)	Thinnest: 0.2mm	T＜0.1mm
	Thickness( T)	Thickest: 4mm	T＞4.5mm
	SMT components specification	Outline Dimension
Min size: 0201(0.6mm*0.3mm)		01005(0.3mm*0.2mm)
Max size: 200*125		200*125
Component thickness: T≤15mm		6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)
Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)
		Minimum: L≥50mm, W≥30mm	L＜50mm
		Maximum: L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
	Thickness( T)	Thinnest: 0.8mm	T＜0.8mm
Thickest: 3.5mm	Thickness( T)	T＞2mm