DQS Electronic Co., Limited
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| MOQ: | 1 |
| Condizioni di pagamento: | T/T |
| Capacità di approvvigionamento: | 700.000 punti/giorno per la post-saldatura |
| Item | Normal | Special |
|---|---|---|
| SMT Assembly PCB Specification |
Length and Width (L*W) Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm |
L＜2mm L＞1200mm, W＞500mm |
| Thickness (T) Thinnest: 0.2mm Thickest: 4mm |
T＜0.1mm T＞4.5mm |
|
| SMT Components Specification Min size: 0201(0.6mm*0.3mm) Max size: 200*125 |
01005(0.3mm*0.2mm) 200*125 |
|
| Component Thickness T≤15mm |
6.5mm＜T≤15mm | |
| QFP,SOP,SOJ (multi pins) Min pin space: 0.4mm |
0.3mm≤Pitch＜0.4mm | |
| CSP/BGA Min ball space: 0.5mm |
0.3mm≤Pitch＜0.5mm | |
| DIP Assembly PCB Specification |
Length and Width (L*W) Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm |
L＜50mm L≥1200mm, W≥500mm |
| Thickness (T) Thinnest: 0.8mm Thickest: 3.5mm |
T＜0.8mm T＞2mm |
