| Item | Normal | Special |
|---|---|---|
| SMT Assembly | PCB Specification | |
| Length and Width (L*W) | ||
| Minimum | L≥3mm, W≥3mm | L<2mm |
| Maximum | L≤800mm, W≤460mm | L>1200mm, W>500mm |
| Thickness (T) | ||
| Thinnest | 0.2mm | T<0.1mm |
| Thickest | 4mm | T>4.5mm |
| SMT Components Specification | Outline Dimension | |
| Min size | 0201 (0.6mm*0.3mm) | 01005 (0.3mm*0.2mm) |
| Max size | 200*125 | 200*125 |
| Component thickness | T≤15mm | 6.5mm<T≤15mm |
| QFP,SOP,SOJ (multi pins) | ||
| Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm |
| CSP/BGA | ||
| Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm |
| DIP Assembly | PCB Specification | |
| Length and Width (L*W) | ||
| Minimum | L≥50mm, W≥30mm | L<50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm |
| Thickness (T) | ||
| Thinnest | 0.8mm | T<0.8mm |
| Thickest | 3.5mm | T>2mm |