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LED Aluminum Circuit Board LED Lights Lamp PCB Integrated Circuit Board

MOQ:	1
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Layer:

2 L

Material:

Board Thickness:

2.0mm

Surface Finish:

OSP

Pin Space:

0.25mm

Application:

Lights Lamp

Highlight:

LED aluminum PCB board

LED lamp circuit board

lighting PCB assembly with warranty

Product Description

LED Aluminum Circuit Board LED Lights Lamp PCB Integrated Circuit Board

What is LED PCB Assembly?

LED PCB Assembly refers to the process of mounting, soldering and electrically connecting light-emitting-diode (LED) packages and their driver/control components onto a printed circuit board (PCB) that has been specially designed for high heat dissipation, so that the finished module can be powered and emit light immediately. Unlike conventional PCBA, LED PCB Assembly focuses on opto-thermal-electrical co-design:

Substrate & thermal management
- Aluminum-core (MCPCB), copper-core or ceramic substrates are used to conduct heat away from the LED junction.
- Thick copper planes, thermal vias and TIMs lower the junction-to-ambient thermal resistance.
Optical requirements
- High-reflectivity white solder-mask (≥88% reflectance) is applied to maximize light output.
- Phosphor dispensing or color-bin matching is controlled to keep chromaticity and CRI within spec.
Typical process flow
Incoming inspection -> solder-paste stencil printing (optimized for thermal pads) -> high-speed pick-and-place (polarity check) -> reflow soldering (peak 240-255°C, nitrogen atmosphere) -> AOI/AXI -> selective wave (if THT parts) -> optical & electrical test (luminous flux, color temp, junction temp) -> burn-in -> conformal coating (lens area masked) -> final QC & pack.
Key applications
Street lighting, automotive lamps, flashlights, surgical lights, TV backlights, high-resolution LED displays--anywhere high brightness, long life and good heat control are required.

Technical Parameters

PCB Assembly Capability	Normal	Special
SMT Assembly PCB(used for SMT) specification
Length and Width (L*W)	Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm	L＜2mm L＞1200mm, W＞500mm
Thickness (T)	Thinnest: 0.2mm Thickest: 4mm	T＜0.1mm T＞4.5mm
SMT components specification
Outline Dimension	Min size: 0201(0.6mm0.3mm) Max size: 200125	01005(0.3mm0.2mm) 200125
Component thickness	T≤15mm	6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly PCB specification
Length and Width (L*W)	Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm	L＜50mm L≥1200mm, W≥500mm
Thickness (T)	Thinnest: 0.8mm Thickest: 3.5mm	T＜0.8mm T＞2mm