products details

Home Products

LED Light SMT PCB Board Aluminum Electronic Multilayer PCBA

MOQ:	1
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Layer:

1 L

Material:

Board Thickness:

2.0mm

Surface Finish:

OSP

Pin Space:

0.25mm

Application:

Street Lights

Highlight:

LED light SMT PCB board

aluminum multilayer PCBA

lighting PCB assembly with warranty

Product Description

LED Light SMT PCB Board Aluminum Electronic Multilayer PCBA

What is multilayer PCBA?

Multilayer PCBA (Multilayer Printed Circuit Board Assembly) is the fully assembled board that contains three or more conductive copper layers laminated together with insulating dielectric material. These internal layers are interconnected by plated-through, blind or buried vias, and carry traces, power planes and ground planes. After the bare multilayer PCB is fabricated, electronic components (both SMD and THT) are soldered onto its outer surfaces, creating the functional multilayer PCBA.

Key points:

Structure
- Alternating layers of copper foil and prepreg/core are pressed into one rigid board.
- Inner layers are etched beforehand; outer layers receive components and final plating.
- Vias (through, blind, buried) provide layer-to-layer connectivity without enlarging the board.
Assembly flow
- Identical to standard PCBA: solder-paste printing -> pick-and-place -> reflow (and/or wave) soldering -> AOI/X-ray/ICT -> final test.
- Extra precautions for warpage and via reliability because of the thicker, high-layer-count substrate.
Design advantages
- Dense, high-speed or RF circuits with dedicated power/ground planes for low noise.
- Miniaturization--more circuitry per cm², essential for smartphones, wearables, aerospace, medical implants, etc.
- Controlled impedance, better EMI shielding and thermal management compared with single- or double-sided boards.
Typical layer counts
- Consumer products: 4-12 layers.
- High-end servers, telecom, military: 20-60 layers.
- Specialty suppliers can exceed 100 layers, but cost and yield become critical.

Technical Parameters

PCB Assembly Capability
Item	Normal	Special
Item	SMT Assembly	PCB(used for SMT) specification
Length and Width( L* W)	Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm	L＜2mm L＞1200mm, W＞500mm
Thickness( T)	Thinnest: 0.2mm Thickest: 4 mm	T＜0.1mm T＞4.5mm
SMT components specification	Outline Dimension Min size: 0201(0.6mm0.3mm) Max size: 200 125 component thickness: T≤15mm	01005(0.3mm0.2mm) 200 125 6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/ BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification
Length and Width( L* W)	Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm	L＜50mm L≥1200mm, W≥500mm
Thickness( T)	Thinnest: 0.8mm Thickest: 3.5mm	T＜0.8mm T＞2mm