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Communication Module BGA PCB Prototype and Assembly
♦ What Is PCB Prototype and Assembly?
PCB Prototype and PCB Assembly are two critical stages in the development of electronic circuits. They involve designing, testing, and manufacturing printed circuit boards (PCBs) before full-scale production.
A PCB prototype is an early-stage sample of a circuit board used for testing and validation before mass production.
✔ Verify functionality before mass production
✔ Detect design errors (e.g., short circuits, incorrect footprints)
✔ Optimize performance (signal routing, power distribution)
PCB Assembly (PCBA) is the process of soldering electronic components onto a bare PCB to create a functional board.
♦ Prototype vs. Mass Production Assembly:
Feature | Prototype Assembly | Mass Production Assembly |
---|---|---|
Volume | Low (1-10 units) | High (100s–1000s) |
Cost per Unit | Higher (manual setup) | Lower (automated) |
Turnaround Time | Faster (days) | Slower (weeks) |
Flexibility | Easier to modify | Harder to change |
♦ Technical Parameters
PCB Assembly Capability |
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Item |
Normal |
Special |
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SMT Assembly |
PCB(used for SMT) specification |
Length and Width( L* W) |
Minimum |
L≥3mm, W≥3mm |
L<2mm |
Maximum |
L≤800mm, W≤460mm |
L > 1200mm, W>500mm |
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Thickness( T) |
Thinnest |
0.2mm |
T<0.1mm |
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Thickest |
4 mm |
T>4.5mm |
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SMT components specification |
Outline Dimension |
Min size |
0201(0.6mm*0.3mm) |
01005(0.3mm*0.2mm) |
|
Max size |
200 * 125 |
200 * 125 |
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component thickness |
T≤15mm |
6.5mm<T≤15mm |
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QFP,SOP,SOJ (multi pins) |
Min pin space |
0.4mm |
0.3mm≤Pitch<0.4mm |
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CSP/ BGA |
Min ball space |
0.5mm |
0.3mm≤Pitch<0.5mm |
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DIP Assembly |
PCB specification |
Length and Width( L* W) |
Minimum |
L≥50mm, W≥30mm |
L<50mm |
Maximum |
L≤1200mm, W≤450mm |
L≥1200mm, W≥500mm |
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Thickness( T) |
Thinnest |
0.8mm |
T<0.8mm |
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Thickest |
3.5mm |
T>2mm |
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