DQS Electronic Co., Limited
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
PCB Assembly
Created with Pixso.

OEM Prototype BGA PCB Assembly Circuit Board for Communication Module

OEM Prototype BGA PCB Assembly Circuit Board for Communication Module

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
ISO, UL, IPC, Reach
Layer:
2-36 Layer
Material:
FR4
Board Thickness:
0.2-10mm
Surface Finish:
ENIG/Immersion Gold/HASL
Pin Space:
0.25mm
Application:
Communication Module
Highlight:

OEM bga pcb assembly

,

Prototype bga pcb assembly

,

BGA prototype circuit board

Product Description

 

Communication Module BGA PCB Prototype and Assembly

 

 

♦ What Is PCB Prototype and Assembly?

 

PCB Prototype​​ and ​​PCB Assembly​​ are two critical stages in the development of electronic circuits. They involve designing, testing, and manufacturing printed circuit boards (PCBs) before full-scale production.

    • ​​Higher density connections​​ (more I/O in a smaller space)
    • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
    • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

​​1. PCB Prototype​​

A ​​PCB prototype​​ is an early-stage sample of a circuit board used for testing and validation before mass production.

​​Key Steps in PCB Prototyping:​​

    1. ​​Design & Layout​​ – Using CAD software (e.g., Altium, KiCad) to create schematics and PCB layouts.
    2. ​​Fabrication​​ – Manufacturing a small batch of bare PCBs (no components yet).
      • ​​Methods:​​
        • ​​CNC Milling​​ (for quick, low-cost prototypes)
        • ​​Chemical Etching​​ (DIY or small-scale)
        • ​​Professional PCB Fabrication​​ (from companies like JLCPCB, PCBWay)
    3. ​​Testing​​ – Checking for design flaws, signal integrity, and thermal performance.

​​Why Prototype?​​

✔ ​​Verify functionality​​ before mass production
✔ ​​Detect design errors​​ (e.g., short circuits, incorrect footprints)
✔ ​​Optimize performance​​ (signal routing, power distribution)

 

2. PCB Assembly (PCBA)​​

​​PCB Assembly (PCBA)​​ is the process of soldering electronic components onto a bare PCB to create a functional board.

​​Types of PCB Assembly:​​

    1. ​​Through-Hole Assembly (THA)​​ – Components with leads inserted into holes and soldered (used for robust, high-power circuits).
    2. ​​Surface-Mount Assembly (SMT/SMD)​​ – Components placed directly onto PCB pads (faster, more compact, used in most modern electronics).
    3. ​​Mixed Assembly​​ – Combines both SMT and through-hole components.

​​PCB Assembly Process:​​

    1. ​​Solder Paste Application​​ – A stencil deposits solder paste on PCB pads.
    2. ​​Component Placement​​ – A pick-and-place machine positions SMD components.
    3. ​​Reflow Soldering​​ – The board passes through an oven to melt solder paste.
    4. ​​Inspection & Testing​​ – Automated Optical Inspection (AOI), X-ray (for BGAs), and functional testing.

 

 

​​♦ Prototype vs. Mass Production Assembly​:

 

Feature Prototype Assembly Mass Production Assembly
​Volume​ Low (1-10 units) High (100s–1000s)
​Cost per Unit​ Higher (manual setup) Lower (automated)
​Turnaround Time​ Faster (days) Slower (weeks)
​Flexibility​ Easier to modify Harder to change

 

 

 

♦ Technical Parameters

 

 PCB Assembly Capability

 

Item

 

                  Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

                      T>2mm

 

 
 
 
 Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

 

Would you like details on ​​PCB Prototype and Assembly?

 Contact us via email : sales@dqspcba.com