Introducing the Tg170 Multilayer Board (3+4+3) HDI PCB, designed for wearable devices. With 12 layers, 1.8mm thickness, and a minimum line width of 0.1mm, it offers high circuit density and excellent signal integrity. Crafted with immersion gold surface treatment, it adheres to UL, IPC, and ISO standards. Ideal for advanced applications requiring reliability and miniaturization. Welcome to visit our website for more details!