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Tg170 Multilayer board（3+4+3） HDI PCB Wearable Devices

PCB Manufacturing
June 05, 2025
Category Connection: PCB Manufacturing
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Tags:
#Fr4 pcb board fabrication #1OZ pcb design manufacturing #Low Volume circuit board fabrication
Brief: Discover the Tg170 Multilayer Board (3+4+3) HDI PCB designed for wearable devices. This ODM Multilayer FR4 PCB offers high-density interconnects, miniaturization, and excellent signal integrity, making it ideal for advanced electronics. Learn about its features, applications, and technical specifications in this video.
Related Product Features:
  • High-density circuit board with micro blind buried via technology for superior performance.
  • 3+4+3 multilayer structure ensures excellent signal integrity and reliability.
  • Miniaturized and thin design perfect for wearable devices and compact electronics.
  • Advanced heat dissipation performance for prolonged device lifespan.
  • Wide range of applications including smartphones, automotive electronics, and medical equipment.
  • Available in various laminate structures to meet diverse project requirements.
  • Manufactured with high Tg170 material for enhanced thermal stability.
  • One-stop PCB solution from prototype to mass production with quality assurance.
Faqs:
  • What is HDI PCB?
    HDI (High Density Interconnect) PCB is a high-density circuit board constructed using micro blind buried via technology, enabling three-dimensional interconnection of inner and outer layer circuits for superior performance and miniaturization.
  • What are the key characteristics of HDI PCB?
    HDI PCBs feature high circuit density, miniaturization, excellent signal integrity, good heat dissipation, high reliability, and are available in various laminate structures to meet diverse needs.
  • What applications are suitable for HDI PCBs?
    HDI PCBs are widely used in smartphones, tablets, laptops, automotive electronics, medical equipment, aerospace, and communication devices due to their high performance and reliability.
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