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4 Layer 1.6mm ENIG PCB Assembly For Communication Equipment

MOQ:	1
가격:	Contact us
지불 조건:	티/티

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상세 정보

층:

4 레이어

민. 성분 사이즈:

0201

보드 두께:

1.6mm

표면 마감:

ENIG

핀 공간:

0.35mm

애플리케이션:

의사소통

강조하다:

4 layer ENIG PCB assembly

1.6mm telecom PCB board

communication equipment PCB assembly

제품 설명

4 Layer 1.6mm ENIG PCB Assembly For Communication Equipment

Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards specifically designed for telecommunications equipment, including 5G/4G base stations, fiber-optic networking devices, satellite communication systems, routers, switches, modems, and RF/microwave systems. These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and demanding operational environments.

Key Features of Telecom PCBs

High-Frequency Materials: Low-loss laminates (Rogers, Teflon, Isola) minimize signal degradation at GHz frequencies with controlled impedance traces
Multilayer & HDI Designs: 8+ layers for complex routing with microvias and blind/buried vias for compact, high-speed designs
RF & Microwave Components: Antennas, amplifiers, filters, and MMICs with shielding to reduce electromagnetic interference
Thermal Management: Metal-core PCBs, heat sinks, and thermal vias to dissipate heat from high-power components
Strict Compliance Standards: IPC-A-600, IPC-6012 for reliability; RoHS, REACH for environmental safety; FCC, CE, ITU-T for telecom regulations

Applications of Telecom PCBs