DQS Electronic Co., Limited
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
PCB Manufacturing
Created with Pixso.

Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias

Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias

MOQ: 1
Price: Contact Us
Payment Terms: T/T
Supply Ability: 200,000+ m² PCB per Month
Detail Information
Layer:
10 Layers
Material:
Fr4
Thickness:
2.0 Mm
Construction:
2+N+2
Min. Line Width/Space:
0.1/0.1mm
Surface Treatment:
Immersion Gold
Type:
Customizable
Application:
Medical Device
Standard:
UL&IPC Standard &ISO
Supply Ability:
200,000+ m² PCB per Month
Highlight:

Half Plating Vias interconnect pcb

,

0.4mm interconnect pcb

,

custom pcb boards HDI

Product Description

 

10 Layer Multilayer HDI Circuit Board 0.4mm Half Plating Vias PCB

 

 

♦ What ​​is Blind Hole in PCBs?

 

Half Plating Vias​​ (also called ​​Partial Plating Vias​​ or ​​Non-Through Plating Vias​​) are a type of via structure used in printed circuit board (PCB) design where the conductive plating does not fully extend through the entire via hole.

 

​​Key Characteristics:​​

    1. ​​Partial Copper Plating​​:

      • Unlike standard ​​fully plated through-hole vias​​, half-plated vias have copper plating only on one side or a portion of the via wall, leaving the other side unplated or partially plated.
    2. ​​Controlled Depth Plating​​:

      • The plating may stop at a certain depth, either by laser drilling, controlled electroplating, or plugging material (e.g., resin).
    3. ​​Common Applications​​:

      • ​​Blind/Buried Vias​​: Used in HDI (High-Density Interconnect) PCBs to connect inner layers without passing through the entire board.
      • ​​Via-in-Pad Designs​​: Helps prevent solder wicking into the via during assembly.
      • ​​RF/Microwave PCBs​​: Reduces parasitic capacitance and improves signal integrity.
      • ​​Thermal Management​​: Used in thermal vias to control heat dissipation.

Manufacturing Methods:​

    • ​​Laser Drilling + Plating​​: Laser creates a cavity, followed by selective plating.
    • ​​Plugging & Partial Plating​​: Filling part of the via with dielectric material before plating.
    • ​​Sequential Lamination​​: Used in HDI PCBs to create buried or blind half-plated vias.

 

 

 

Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 0 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 1 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 2

 

 

 

 

♦ ​​​​Comparison with Other Via Types?​

 

​Via Type​ ​Plating Coverage​ ​Usage​
​Through-Hole Via​ Fully plated (entire hole) Standard PCBs
​Blind Via​ Plated from surface to inner layer HDI PCBs
​Buried Via​ Plated between inner layers Multilayer PCBs
​Half Plating Via​ Partially plated (one side or depth-controlled) Specialized designs

 

 

 

♦ ​​Conclusion

Half plating vias are an advanced PCB design technique used to optimize space, signal performance, and manufacturability in complex multilayer boards, especially in high-frequency and miniaturized electronics.

 

 

 

Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

One-Stop PCBs Solution

 

Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 3 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 4 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 5 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 6
PCB Prototype Felx PCB  Rigid-Flex PCB Ceramic PCB
Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 7 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 8 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 9 Custom Multilayer HDI Interconnect PCB Circuit Board 0.4mm Half Plating Vias 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production