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10 Layer Multilayer HDI Circuit Board 0.4mm Half Plating Vias PCB
♦ What is Blind Hole in PCBs?
Half Plating Vias (also called Partial Plating Vias or Non-Through Plating Vias) are a type of via structure used in printed circuit board (PCB) design where the conductive plating does not fully extend through the entire via hole.
Partial Copper Plating:
Controlled Depth Plating:
Common Applications:
♦ Comparison with Other Via Types?
Via Type | Plating Coverage | Usage |
---|---|---|
Through-Hole Via | Fully plated (entire hole) | Standard PCBs |
Blind Via | Plated from surface to inner layer | HDI PCBs |
Buried Via | Plated between inner layers | Multilayer PCBs |
Half Plating Via | Partially plated (one side or depth-controlled) | Specialized designs |
♦ Conclusion
Half plating vias are an advanced PCB design technique used to optimize space, signal performance, and manufacturability in complex multilayer boards, especially in high-frequency and miniaturized electronics.
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |