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Rogers RT5880 High Frequency PCB Satellite Communication System Application
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ Difficulties in High-frequency PCB Manufacturing Process
Material processing is difficult: PTFE drilling is prone to burrs, and tungsten carbide drill bits + plasma cleaning are required.
High micropore precision: small holes are prone to offset, laser drilling + electroplating filling holes.
Difficult graphic transfer: small line width is prone to deviation, LDI lithography + fine etching.
Difficult inter-layer alignment: lamination is prone to misalignment, CCD alignment control offset ≤±50μm.
Difficult surface treatment: uneven coating affects performance, and the coating thickness is strictly controlled.
♦ Technical Parameters
|
Item |
Specification |
|
Laers |
1~32 |
|
Board thickness |
0.1mm-7.0mm |
|
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
|
Max panel size |
32"×48"(800mm×1200mm) |
|
Min hole size |
0.075mm |
|
Min line width |
3mil(0.075mm) |
|
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
|
Copper thickness |
0.5-7.0OZ |
|
Soldermask |
Green/Yellow/Black/White/Red/Blue |
|
Silkscreen |
Red/Yellow/Black/White |
|
Min PAD |
5mil(0.13mm) |
|
Inter package |
Vacuum |
|
Outer package |
Carton |
|
Outline tolerance |
±0.75mm |
|
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
|
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
|
Special request |
Blind hole+Gold finger + BGA |
|
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |