| MOQ: | 1 |
| Le Prix: | Contact Us |
| Conditions De Paiement: | T / t |
| Capacité à Fournir: | 200,000+ m2 de PCB par mois |
HDI PCB (High-Density Interconnect Printed Circuit Board) is a circuit board built with very fine lines/spaces (≤ 100 µm), micro-vias (≤ 150 µm), blind/buried vias, and often sequential lamination or laser-drilled stacked vias, so that more components and routing can fit in a smaller area. The result is thinner, lighter boards with higher I/O counts, shorter signal paths and better electrical performance--ideal for smartphones, tablets, medical implants, IoT modules and any application demanding miniaturization and high speed.
| Item | Spec |
|---|---|
| Layers | 1~64 |
| Board Thickness | 0.1mm-10 mm |
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
| Max Panel Size | 800mm×1200mm |
| Min Hole Size | 0.075mm |
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
| Board Outline Tolerance | ±0.10mm |
| Insulation Layer Thickness | 0.075mm--5.00mm |
| Out Layer Copper Thickness | 18um--350um |
| Drilling Hole (Mechanical) | 17um--175um |
| Finish Hole (Mechanical) | 17um--175um |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 17:01 |
| Solder Mask Type | LPI |
| SMT Min. Solder Mask Width | 0.075mm |
| Min. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm--0.60mm |