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Best Price16 Layers Prototype Board HDI Multilayer PCB

Best Price16 Layers Prototype Board HDI Multilayer PCB

MOQ: 1
Prezzo: Contact Us
Condizioni di pagamento: T/t
Capacità di approvvigionamento: 200,000+ m2 di PCB al mese
Informazione dettagliata
Strato:
10 strati
Materiale:
FR4
Spessore:
2,0 mm
Costruzione:
3+N+3
Minuti linea larghezza/spazio:
0.1/0.1 mm
Trattamento superficiale:
oro di immersione
Tipo:
Personalizzabile
Applicazione:
Prodotti elettronici
Standard:
Standard UL&IPC e ISO
Capacità di alimentazione:
200,000+ m2 di PCB al mese
Evidenziare:

16 layer HDI multilayer PCB prototype

,

high density interconnect PCB prototype board

,

HDI multilayer PCB with warranty

Descrizione di prodotto
Best Price 16 Layers Prototype Board HDI Multilayer PCB
What is HDI PCBs?

HDI PCB (High-Density Interconnect Printed Circuit Board) is a circuit board built with very fine lines/spaces (≤ 100 µm), micro-vias (≤ 150 µm), blind/buried vias, and often sequential lamination or laser-drilled stacked vias, so that more components and routing can fit in a smaller area. The result is thinner, lighter boards with higher I/O counts, shorter signal paths and better electrical performance--ideal for smartphones, tablets, medical implants, IoT modules and any application demanding miniaturization and high speed.

HDI Board Classification
  • 1st-order (1+N+1) - one build-up layer per side; only one laser-drill step is needed.
  • 2nd-order (2+N+2) - two build-up layers per side; requires two laser-drill and lamination cycles (can be staggered or stacked micro-vias).
  • 3rd-order (3+N+3) - three build-up layers per side; three sequential drilling/lamination cycles.
  • Any-layer (ELIC) - every adjacent pair of layers can be interconnected with laser micro-vias, giving the highest density and no fixed "order" limit.
Best Price16 Layers Prototype Board HDI Multilayer PCB 0 Best Price16 Layers Prototype Board HDI Multilayer PCB 1 Best Price16 Layers Prototype Board HDI Multilayer PCB 2
Technical Parameters
Item Spec
Layers 1~64
Board Thickness 0.1mm-10 mm
Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size 800mm×1200mm
Min Hole Size 0.075mm
Min Line Width/Space Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance ±0.10mm
Insulation Layer Thickness 0.075mm--5.00mm
Out Layer Copper Thickness 18um--350um
Drilling Hole (Mechanical) 17um--175um
Finish Hole (Mechanical) 17um--175um
Diameter Tolerance (Mechanical) 0.05mm
Registration (Mechanical) 0.075mm
Aspect Ratio 17:01
Solder Mask Type LPI
SMT Min. Solder Mask Width 0.075mm
Min. Solder Mask Clearance 0.05mm
Plug Hole Diameter 0.25mm--0.60mm
One-Stop PCBs Solution
Best Price16 Layers Prototype Board HDI Multilayer PCB 3 Best Price16 Layers Prototype Board HDI Multilayer PCB 4 Best Price16 Layers Prototype Board HDI Multilayer PCB 5 Best Price16 Layers Prototype Board HDI Multilayer PCB 6 Best Price16 Layers Prototype Board HDI Multilayer PCB 7 Best Price16 Layers Prototype Board HDI Multilayer PCB 8 Best Price16 Layers Prototype Board HDI Multilayer PCB 9 Best Price16 Layers Prototype Board HDI Multilayer PCB 10
Advantages of DQS Team
On-time Delivery
  • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines
  • 4 DIP assembly lines
Quality Guaranteed
  • IATF, ISO, IPC, UL standards
  • Online SPI, AOI, X-Ray Inspection
  • The qualified rate of products reach 99.9%
Premium Service
  • 24H reply your inquiry
  • Perfect after-sales service system
  • From prototype to mass production