E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards

Place of Origin Shenzhen
Brand Name YScircuit
Certification ISO9001,UL,REACH, RoHS
Model Number YS-HDI-0015
Minimum Order Quantity 1 piece
Price 0.07-5$/piece
Packaging Details Foam cotton + carton + strap
Delivery Time 2-8 days
Payment Terms T/T,PayPal, Alibaba pay
Supply Ability 251,000 square meter/year

Contact me for free samples and coupons.

Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

If you have any concern, we provide 24-hour online help.

x
Product Details
Material FR4 Size 25*15cm
Process Immersion Gold Surface Finishing HASL/HASL-LF/ENIG/OSP
Copper Thickness 3oz Application Engine Control Units
Color 0.25mm(10mil) TG 175
High Light

E Vehicle High Density Interconnect PCB

,

3oz High Density Interconnect PCB

,

FR4 HDI Printed Circuit Boards

Leave a Message
Product Description

E Vehicle PCB High Density Interconnect PCB HDI Printed Circuit Boards

 

High Density Interconnect(HDI) PCBs

HDI PCBs are printed circuit boards with a much higher wiring and pad connection density than a traditional PCB. HDI PCBs are characterized by finer lines, closer spaces, smaller capture pads, and Micro-Vias. HDI PCB manufacturing is a growing area since market demand for lightweight and thinner PCBs that can handle High Speed Signals with low signal loss has steadily increased as consumer electronics end-products are produced in smaller form factors.


Our manufacturing facilities have the following HDI PCB manufacturing capabilities:

Buried and Blind Vias, including Micro Vias
NCVF
Copper Fill
Sequential Lamination
3/3 Traces/Space
5% Controlled Impedance tolerance
At the present time, YScircuit can produce sequential lamination boards of up to 40 layers. Our facilities have been fitted with the most advanced Laser Drilling Machines, which are capable of laser drilling holes as small as 0.002 inch (2 mil). With the latest HDI technology, we can produce inner and outer layers with as little as a 3/3 Trace/Space featuring excellent registration.

 

HDI PCB Matrix:

HDI PCB 2+n+2

YScircuit HDI PCB manufacturing capabilities overview

Feature

capabilities

Layer Count

4-60L

Available HDI PCB Technology

1+N+1

2+N+2

3+N+3

4+N+4

5+N+5

Any layer

Thickness

0.3mm-6mm

Minimum line Width and Space

0.05mm/0.05mm(2mil/2mil)

BGA PITCH

0.35mm

Min laser Drilled Size

0.075mm(3nil)

Min mechanical Drilled Size

0.15mm(6mil)

Aspect Ratio for laser hole

0.9:1

Aspect Ratio for through hole

16:1

Surface Finish

HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.

Via Fill Option

The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over

Copper filled, silver filled

Laser via copper plated shut

Registration

±4mil

Solder Mask

Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

 

YScircuit Bare Boards Normally Delivery Time

layer/m²

S<1㎡

S<3㎡

S<6㎡

S<10㎡

S<13㎡

S<16㎡

S<20㎡

S<30㎡

S<40㎡

S<50㎡

S<65㎡

S<85㎡

S<100㎡

1L

4wds

6wds

7wds

7wds

9wds

9wds

10wds

10wds

10wds

12wds

14wds

15wds

16wds

2L

4wds

6wds

9wds

9wds

11wds

12wds

13wds

13wds

15wds

15wds

15wds

15wds

18wds

4L

6wds

8wds

12wds

12wds

14wds

14wds

14wds

14wds

15wds

20wds

25wds

25wds

28wds

6L

7wds

9wds

13wds

13wds

17wds

18wds

20wds

22wds

24wds

25wds

26wds

28wds

30wds

8L

9wds

12wds

15wds

18wds

20wds

20wds

22wds

24wds

26wds

27wds

28wds

30wds

30wds

10L

10wds

13wds

17wds

18wds

20wds

20wds

22wds

24wds

26wds

27wds

28wds

30wds

30wds

12L

10wds

15wds

17wds

18wds

20wds

20wds

22wds

24wds

26wds

27wds

28wds

30wds

30wds

14L

10wds

16wds

17wds

18wds

20wds

20wds

22wds

24wds

26wds

27wds

28wds

30wds

30wds

16L

10wds

16wds

17wds

18wds

20wds

20wds

22wds

24wds

26wds

27wds

28wds

30wds

 30wds

E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards 1

E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards 2

E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards 3

E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards 4

E Vehicle High Density Interconnect PCB HDI Printed Circuit Boards 5

 

FQA

 

Q: Which software you propose to create a pcb? / What files do you need?
A: You provide us with PCB design files in Gerber, or files in PCB formats.

 

Q: I need to change the PCB file of my order, how can I do that?
A: You may change the file without cost if the order hasn't been confirmed. Once the order is confirmed and scheduled for production, there will be some scrap fee:
1. If it's a prototype order, the whole order value will be scrapped;
2. If it's a standard PCB order, the scrap fee will be charged based on the production process.
To change your file, please send the updated PCB file along with the order number and PCB part number to info@yscircuit.com. We'll react very quickly.

 

Q: I need to change BOM of my assembly order. What should I do?
A: Please send the final BOM to info@yscircuit.com. We'll handle the rest.

 

Q: Can you review my PCB files first? I need to know that you have the capabilities to make my boards before order.
A: We have capabilities to manufacture almost all kinds of circuit boards. Please check our PCB manufacturing capabilities first, then submit the order online. Once payment received, we'll carry out DFM check. We'll be in touch if there's any question on your file.

 

Q: I only have single PCB file, can you panelize the file and manufacture boards in panels?
A: Yes, we offer PCB file panelization service. Our engineers will panelize the file based on your circuit spec and send you the final panelized file for confirmation.