OEM Electronic PCBA Circuit Board Assembly Copper Thickness 3OZ

OEM Electronic PCBA Circuit Board Assembly Copper Thickness 3OZ

Pcb Manufacturing Pcba OEM Electronic Print Circuit Board Assembly Controller PCBA

These materials and components remain largely the same across all PCBs, with the exception of the substrate. The substrate material of a PCB changes according to the specific qualities — such as cost and bendability — each designer is looking for in their finished product.

Through Hole PCBA

Through hole parts come in radial, axial and multiple lead in many configurations. Before surface mount technology became popular in the 1980s through hole (often spelt thru-hole) was the primary method of PCB assembly for some decades. Usually mass loaded and wave soldered we hand solder through hole components when necessary.
Although generally considered the simplest form of soldering, through hole soldering is best performed by appropriately trained and skilled staff.

Wave Soldering

Our wave soldering machine is fairly standard. PCBs go into special carriers and traverse the conveyor through the flux applicator into pre-heating and finally onto the wave itself. We use non-corrosive flux where possible and the wave soldering machine usually has fairly standard 63/37 solder in it. We offer PCB cleaning, for conformal coating or similar process, but if corrosive flux is used the PCBs must be cleaned anyway.
Considerations to thermal shock, heat sinks (actual and large ground planes with direct connections), thermal sensitivity of some parts and potential contaminants are very important in the wave soldering process

Manual Soldering

Some parts or circumstances call for manual placement and soldering of parts. A part may have thermal profile requirements that preclude it from wave soldering. PCBs with double sided SMT load, where glue was not acceptible, usually have very few through hole parts but they will have to be manually placed and soldered in most cases.
Some (though not many) SMT parts cannot withstand the minimum thermal profile necessary in the reflow oven for the rest of the PCB in question.