Electronic PCBA Circuit Board Assembly Multi Layer With 6OZ Copper Thickness

High quality active subwoofer amplifier pcb assembly Electronic multi-layer circuit board

Surface Mount Technology Assembly Process
Compared with thru-hole mounting process, surface mounting process stands out in terms of manufacturing efficiency because it features a totally automatic mounting PCB assembly process from solder paste printing, pick and place and reflow soldering.
• Step 1: Solder Paste Printing - Solder paste is applied on the board through a solder paste printer. A template ensures that solder paste can be accurately left on correct places where components will be mounted, which is also called stencil or solder screen. Because quality of solder paste printing is directly associated with quality of soldering, PCBA manufacturers focusing on high quality products usually carry out inspections after solder paste printing through a solder paste inspector. This inspection guarantees printing has achieved regulations and standards. If defects are found on solder paste printing, printing has to be reworked or solder paste will be washed off prior to second printing.
• Step 2: Components Mounting - After coming out of solder paste printer, PCB will be auto-sent to pick-and-place machine where components or ICs will be mounted on corresponding pads in the effect of tension of solder paste. Components are mounted on PCB board through component reels in the machine. Similar to film reels, component reels carrying components rotate to provide parts to the machine, which will quickly stick parts to the board.
• Step 3: Reflow Soldering - After every component is placed, the board passes through a 23-foot-long furnace. A temperature of 500°F causes the solder paste to liquefy. Now the SMD components are bound firmly to the board.