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Metal Core PCB Circuit Board Production Thick Copper Printed Circuit Board Manufacturer

Metal Core PCB Circuit Board Production Thick Copper Printed Circuit Board Manufacturer

MOQ: 1
Precio: Send us Gerber file for free quotation
Condiciones De Pago: T/T
Información detallada
Capa:
1-6 capa
Material base:
Base Al, base de CU, base Fe, base de cerámica
Espesor:
0.5-10 mm
Cobre:
0.5-15OZ
Línea anchura mínima/espacio:
0.1/0.1 mm
Color:
Blanco, negro, gris amarillo, gris plateado, etc.
Solicitud:
Módulo de potencia, industria
Certificado:
UL, IATF16949, ISO y Reach
Resaltar:

Metal Core PCB thick copper

,

Thick Copper PCB manufacturer

,

Printed Circuit Board production

Descripción de producto
Metal Core PCB Circuit Board Production Thick Copper Printed Circuit Board Manufacturer
A Metal Core PCB (MCPCB)--also called an IMS (Insulated Metal Substrate)--is a printed-circuit board whose base layer is a thick metal plate (almost always aluminum, sometimes copper or steel) instead of the traditional FR-4 fiberglass. A thin dielectric (5-150 µm) is bonded on top of the metal to isolate the copper circuit layer while still conducting heat efficiently.
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Key Points of Metal Core PCB
  • Purpose: move heat away from hot components (LEDs, power MOSFETs, IGBTs, laser diodes, automotive ECUs).
  • Layer stack-up (single-side example):
    • Silk / solder-mask
    • 35-70 µm copper traces
    • 50-150 µm thermally conductive but electrically insulating dielectric
    • 1-3 mm aluminum (or copper) base-plate
    (double-side or multilayer MCPCB are also possible, but single-side is >90% of the market)
  • Thermal performance: dielectric thermal conductivity 1-10 W/m*K (vs ~0.3 W/m*K for FR-4); junction-to-ambient thermal resistance can drop by 50-80%.
  • Machining: can be punched, milled, drilled, V-scored like FR-4, but carbide tools and higher spindle speeds are used for aluminum.
  • Applications: high-power LED modules, street-light COB arrays, automotive headlights, power converters, motor drives, solid-state relays, photovoltaic inverters.
Technical Parameters
Item Specification
Layers 1~32
Board thickness 0.1mm-7.0mm
Material FR-4,CEM-1/CEM-3,PI,High Tg,Rogers
Max panel size 32"×48"(800mm×1200mm)
Min hole size 0.075mm
Min line width 3mil(0.075mm)
Surface finish OSP,HASL,Imm Gold/Nickel/Ag, Electric gold
Copper thickness 0.5-7.0OZ
Soldermask Green/Yellow/Black/White/Red/Blue
Silkscreen Red/Yellow/Black/White
Min PAD 5mil(0.13mm)
Inter package Vacuum
Outer package Carton
Outline tolerance ±0.75mm
Hole tolerance PTH:±0.05 NPTH:±0.025
Certificate UL,ISO 9001,ISO14001,IATF16949
Special request Blind hole+Gold finger + BGA
Material Suppliers Shengyi, KB, Nanya, ITEQ, etc.
One-Stop PCBs Solution
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Advantages of DQS Team
  • On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines
  • Quality Guaranteed:
    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%
  • Premium Service:
    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production