4mil Metal Core Multilayer PCB Prototype With FR4 Sheet Material

Place of Origin China
Brand Name YS
Certification ISO9001
Model Number YS-0001
Minimum Order Quantity 1
Price 0.2-6$/pieces
Packaging Details carton
Delivery Time 7 work days
Payment Terms L/C, T/T, Western Union, MoneyGram,
Supply Ability 1580000

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Product Details
Application Application Product Name Metal Core Pcb Circuit Board
Certificate ISO9001 Base Material FR-4
Min. Line Spacing 4mil Board Thickness 1.6mm
Min. Line Width 3mi
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4mil Multilayer PCB Prototype

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FR4 Multilayer PCB Prototype

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Product Description
multilayer PCB prototype One-stop Service customized FR4 sheet PCB design fabrication suppliers
What is Multilayer PCBs
It is a type of PCB which comes with a combination of single sided PCB and double sided PCB.The most common alloying elements used in hard gold plating are cobalt, nickel or iron.
PCB Sideplating
Sideplating is the metalization of the board edge in the PCB filed.Edge plating, Border plated, these words can also be used to describe the same function.
Half-cut Castellated Holes
These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.
Parameters
  • Layers: 8L multilayer pcb
  • Board Thinkness:2.0mm
  • Base Material:S1000-2 High tg
  • Min Holes:0.2mm
  • Minimum Line Width/Clearance:0.25mm/0.25mm
  • Minimum Clearance between Inner Layer PTH to Line: 0.2mm
  • Size:250.6mm×180.5mm
  • Aspect Ratio:10 : 1
  • Surface treatment:ENIG+ Selective hard gold
  • Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
  • Applications: Wi-Fi modules
YS Multilayer PCB manufacturing capabilities overview
Feature capabilities
Layer Count 3-60L
Available Multilayer PCB Technology Through hole with Aspect Ratio 16:1
buried and blind via
Hybrid High Frequency Material such as RO4350B and FR4 Mix etc.
High Speed Material such as M7NE and FR4 Mix etc.
Thickness 0.3mm-8mm
Minimum line Width and Space 0.05mm/0.05mm(2mil/2mil)
BGA PITCH 0.35mm
Min mechanical Drilled Size 0.15mm(6mil)
Aspect Ratio for through hole 16:1
Surface Finish HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc.
Via Fill Option The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
Copper filled, silver filled
Registration ±4mil
Solder Mask Green, White, Black, Purple, Matte Black, Matte green.etc.

4mil Metal Core Multilayer PCB Prototype With FR4 Sheet Material 0

4mil Metal Core Multilayer PCB Prototype With FR4 Sheet Material 1

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FQA

 

1. What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.

 

2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure.

 

3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.

ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.

 

A popular trend among manufacturers is board-to-board soldering.

This technique allows companies to produce integrated modules (often containing dozens of parts) on a single board that can be built into another assembly during production.

One easy way to produce a PCB that is destined to be mounted to another PCB is to create castellated mounting holes.

These are also known as "castellated vias" or "castellations."