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BMS Printed Circuit Board Assembly Electronic PCB Assembly

BMS Printed Circuit Board Assembly Electronic PCB Assembly

MOQ: 1
가격: Inquiry Us
지불 조건: t/t
상세 정보
층:
12L
기본 자료:
FR4
민. 성분 사이즈:
0201
PCB 두께:
1.5mm
핀 공간:
0.1mm
표면 마감:
hasl
테스트 방법:
비행 프로브, ICT, 기능 테스트, AOI
애플리케이션:
태블릿
강조하다:

BMS PCB assembly electronic

,

printed circuit board assembly PCBA

,

electronic PCB assembly with warranty

제품 설명

BMS Printed Circuit Board Assembly Electronic PCB Assembly


What is BMS?


A BMS is a Battery Management System—the electronic “brain” that keeps a rechargeable battery pack safe, reliable, and long-lasting.
It is almost always built around a dedicated BMS PCBA (assembled circuit board) that is mounted directly on or inside the battery pack.



♦ Key Jobs the BMS PCBA Continuously Performs: 

  • Key jobs the BMS PCBA continuously performs:
  • Cell-level voltage monitoring (over-charge & over-discharge protection)
  • Current monitoring (charge/discharge over-current & short-circuit cut-off)
  • Temperature sensing (thermal run-away prevention; heater control in cold)
  • Cell balancing (bleeds charge from higher-voltage cells so the pack stays in balance, raising usable capacity and life)
  • State-of-charge (SOC) & state-of-health (SOH) fuel-gauge calculations
  • Communication (I²C, CAN, UART, BLE, etc.) to host device or charger
  • Power-path / pre-charge control (hot-swap inrush limiting, sleep-mode MOSFETs)


♦ DQS's PCB Assembly Capability


 

Item

 

Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

     T>2mm




♦ One-Stop Electronic Manufacturing Including


 PCB Prototype

Quick Turn PCB

Single-Sided PCB

Double-Sided PCB

 Multilayer PCB

Rigid PCB

Flexible PCB

Rigid-Flex PCB Rigid-Flex PCB Aluminum PCB Metal Core PCB

Thick Copper PCB

HDI PCB

BGA PCB High TG PCB PCB Stencil Impedance Control PCB

PCB Assembly

High-Frequency PCB Bluetooth Circuit Board Automotive PCB USB Circuit Board Halogen-Free PCB

Antenna PCB



Core Competencies of DQS PCB Assembly


SMT

BMS Printed Circuit Board Assembly Electronic PCB Assembly 0

DIP

BMS Printed Circuit Board Assembly Electronic PCB Assembly 1

  • 13 automatic high-speed SMT line
  • 5 million points / day
  • FPC/Double sided mounted
  • Automatic conformal coating
  • 4 DIP line
  • Post-soldering700,000 points/day
  • Professional DIP plug-in team
BMS Printed Circuit Board Assembly Electronic PCB Assembly 2 SMT Technology BMS Printed Circuit Board Assembly Electronic PCB Assembly 3 PCBA OEM
  • Min package: 01005  
  • Min pin: 0.3mm
  • Min BGA pitch: 0.3 mm 


  •  Full turnkey PCB assembly
  • Partial turnkey PCB assembly