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OEM and ODM 4 Layer PCB Board Multilayer Circuit Board Assembly

MOQ:	1
支払条件:	T/T
供給能力:	溶接後7000ポイント/日

詳細情報

製品の説明

詳細情報

証明:

ISO, UL, IPC, Reach

層:

4レイヤー

材料:

FR4

ボードの厚さ:

1.5mm

表面仕上げ:

浸漬ゴールド

ピンスペース:

0.2mm

応用:

医学

供給の能力:

溶接後7000ポイント/日

ハイライト:

4 layer PCB board assembly

multilayer circuit board OEM

ODM PCB assembly service

製品の説明

OEM and ODM 4 Layer PCB Board Multilayer Circuit Board Assembly

What Is 4 Layer PCB Board?

A 4-layer PCB is a printed circuit board that contains four conductive copper layers separated by insulating material (typically fiberglass and epoxy resin, like FR4). These layers are laminated together under heat and pressure to form a single, solid board.

Structure of a 4-Layer PCB:

The typical stack-up is:

Top Layer - Signal routing (components often placed here)
Internal Layer 1 - Ground plane (GND)
Internal Layer 2 - Power plane (VCC)
Bottom Layer - Additional signal routing

This configuration helps:

Reduce electromagnetic interference (EMI)
Improve signal integrity
Provide stable power distribution
Allow denser and more complex routing than 2-layer boards

Types of PCB Assembly Services:

Turnkey PCB Assembly: Full service (PCB fabrication + component sourcing + assembly)
Partial (Consignment) Assembly: Customer provides components; the assembler handles soldering
Prototype Assembly: Low-volume assembly for testing designs
High-Volume Production: Mass production for commercial devices

DQS Electronic Group is one of the leading EMS company in China, we provide PCB design, PCB manufacturing, PCB assembly service and testing. Welcome send us your Gerber file to get free quotation. Our email: info@dqspcba.com

Technical Parameters

PCB Assembly Capability	Normal	Special
SMT Assembly	PCB(used for SMT) specification
Length and Width( L* W)	Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm	L＜2mm L＞1200mm, W＞500mm
Thickness( T)	Thinnest: 0.2mm Thickest: 4 mm	T＜0.1mm T＞4.5mm
SMT components specification	Outline Dimension Min size: 0201(0.6mm0.3mm) Max size: 200 125	01005(0.3mm0.2mm) 200 125
component thickness	T≤15mm	6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/ BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification
Length and Width( L* W)	Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm	L＜50mm L≥1200mm, W≥500mm
Thickness( T)	Thinnest: 0.8mm Thickest: 3.5mm	T＜0.8mm T＞2mm