DQS Electronic Co., Limited
|
| MOQ: | 1 |
| Zahlungsbedingungen: | T/t |
| Versorgungsfähigkeit: | Nach dem Löten 700.000 Punkte/Tag |
| PCB Assembly Capability | Normal | Special |
|---|---|---|
| SMT Assembly | PCB(used for SMT) specification | |
| Length and Width( L* W) | ||
| Minimum: L≥3mm, W≥3mm | L＜2mm | |
| Maximum: L≤800mm, W≤460mm | L＞1200mm, W＞500mm | |
| Thickness( T) Thinnest: 0.2mm | T＜0.1mm | |
| Thickest: 4 mm | T＞4.5mm | |
| SMT components specification | Outline Dimension | |
| Min size: 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size: 200 * 125 | 200 * 125 | |
| component thickness: T≤15mm | 6.5mm＜T≤15mm | |
| QFP,SOP,SOJ (multi pins) | ||
| Min pin space: 0.4mm | 0.3mm≤Pitch＜0.4mm | |
| CSP/ BGA Min ball space: 0.5mm | 0.3mm≤Pitch＜0.5mm | |
| DIP Assembly | PCB specification | |
| Length and Width( L* W) | ||
| Minimum: L≥50mm, W≥30mm | L＜50mm | |
| Maximum: L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |
| Thickness( T) Thinnest: 0.8mm | T＜0.8mm | |
| Thickest: 3.5mm | T＞2mm |
