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2mm Thickness 2OZ ENIG Aluminum PCB for Power

MOQ:	1
Price:	Inquiry Us
Payment Terms:	T/T
Supply Ability:	200,000+ m² PCB per Month

Detail Information

Product Description

Detail Information

Layer:

2 Layer

Board Thickness:

2.0 Mm

Material:

Aluminum

Min. Line Width/Space:

0.1/0.1mm

Color:

White

Surface Treatment:

HASL

Application:

Lighting

Certificate:

UL,CE,Rohs,IATF16949,ISO

Type:

Customizable

Supply Ability:

200,000+ m² PCB per Month

Highlight:

2mm thick aluminum PCB

2OZ ENIG aluminum PCB

aluminum PCB for power applications

Product Description

2mm Thickness 2OZ ENIG Aluminum PCB for Power Applications

Aluminum substrate is a functional circuit board with aluminum (or aluminum alloy) as the base material. It is primarily composed of a circuit layer (copper foil), insulation layer, and metal base layer. Its core value lies in efficient heat dissipation and high power carrying capacity, making it widely used in electronic devices that are sensitive to heat or require high current drive.

Key Features of Aluminum PCB

Excellent heat dissipation performance: Aluminum substrate thermal conductivity (150~240 W/(m*K)) significantly outperforms standard FR-4 epoxy resin boards (0.3~0.5 W/(m*K)), enabling rapid heat transfer to housing or heat sinks to prevent local overheating
Superior electrical performance: Insulation layer dielectric constant (3~5) is optimized for medium and high frequency circuits, though ceramic substrates remain preferred for high-frequency applications
High rigidity and structural stability: Aluminum substrate mechanical strength exceeds organic substrates like FR-4, providing excellent resistance to bending and vibration for demanding automotive and industrial applications

Primary Applications

LED lighting systems: Effectively manages high heat generation from LED lamp beads in street lights, spotlights, and automotive headlights to ensure stable performance and extended lifespan
Power supply and power devices: Ideal for high-current applications including switching power supplies, inverters, and frequency converters, efficiently dissipating heat from IGBTs and MOS transistors
Automotive electronics: Essential for on-board chargers (OBCs), DC-DC converters, and automotive lighting drive modules operating in high-temperature engine compartment environments
Industrial control systems: Provides reliable heat dissipation and circuit integration for high-voltage equipment including servo drives and PLC controllers

Technical Specifications

Parameter	Specification
Layers	1~32
Board Thickness	0.1mm-7.0mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers
Maximum Panel Size	32"×48"(800mm×1200mm)
Minimum Hole Size	0.075mm
Minimum Line Width	3mil(0.075mm)
Surface Finish	OSP, HASL, Imm Gold/Nickel/Ag, Electric Gold
Copper Thickness	0.5-7.0OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Minimum PAD	5mil(0.13mm)
Inter Package	Vacuum
Outer Package	Carton
Outline Tolerance	±0.75mm
Hole Tolerance	PTH:±0.05 NPTH:±0.025
Certification	UL, ISO 9001, ISO14001, IATF16949
Special Requests	Blind hole + Gold finger + BGA
Material Suppliers	Shengyi, KB, Nanya, ITEQ, etc.