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1-32 Layer High Frequency Multilayer PCB Manufacturer from China

MOQ:	1
価格:	Send us Gerber file for free quotation
支払条件:	T/T

詳細情報

製品の説明

詳細情報

層:

1〜32 Layer

材料:

高周波

厚さ:

0.5-10mm

最少線幅/スペース:

0.1/0.1mm

銅の厚さ:

0.5-15オンス

表面処理:

浸漬ゴールド

応用:

医療、産業用制御

証明書:

UL & IPC 規格 & ISO

ハイライト:

1-32 layer high frequency PCB

multilayer high frequency circuit board

China high frequency PCB manufacturer

製品の説明

1-32 Layer High Frequency Multilayer PCB Manufacturer from China

What's High Frequency PCB?

High-Frequency PCB is a specialized printed circuit board designed to operate at frequencies typically ≥ 1 GHz, with some definitions starting at 300 MHz. These PCBs are engineered to minimize signal loss, control impedance precisely, and resist electromagnetic interference (EMI)--all critical for applications like 5G, radar, satellite communication, and RF/microwave systems.

Key characteristics include:

Low Dielectric Constant (Dk): Ensures stable signal propagation and impedance control.
Low Dissipation Factor (Df): Reduces energy loss as heat, preserving signal integrity.
Stable Coefficient of Thermal Expansion (CTE): Prevents delamination under thermal stress.
Specialized Materials: Such as PTFE-based laminates (e.g., Rogers RO4000®), ceramic-filled composites, or hydrocarbon ceramics, which outperform standard FR-4 in high-frequency performance.

Common Applications

You'll find High-Frequency PCBs in any device that transmits or receives high-frequency signals:

Radar Systems: (Automotive, Aerospace, Defense)
5G & 6G Telecommunications: Base stations, antennas, and network equipment.
Satellite Communication Systems
Microwave Equipment
Advanced Wireless Systems: Wi-Fi 6/6E/7, Bluetooth.
Medical Devices: MRI machines, high-end imaging systems.
High-Speed Digital Applications: Server backplanes, high-speed data transmission.

Key Takeaways

Feature	Standard PCB (e.g., FR-4)	High-Frequency PCB
Primary Goal	Cost-effectiveness, general circuitry	Signal Integrity at high frequencies
Core Material	FR-4 (Epoxy glass)	PTFE (Teflon), Ceramic Composites
Key Parameter	General electrical insulation	Low & Stable Dk, Very Low Df
Cost	Low	Significantly Higher
Typical Applications	Consumer electronics, power supplies	Radar, 5G, Satellite Communication

Technical Parameters

Item	Specification
Layers	1~64
Board thickness	0.1mm-7.0mm
Material	FR-4,CEM-1/CEM-3,PI,High Tg,Rogers
Max panel size	32"×48"(800mm×1200mm)
Min hole size	0.075mm
Min line width	3mil(0.075mm)
Surface finish	OSP,HASL,Imm Gold/Nickel/Ag, Electric gold
Copper thickness	0.5-7.0OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Min PAD	5mil(0.13mm)
Inter package	Vacuum
Outer package	Carton
Outline tolerance	±0.75mm
Hole tolerance	PTH:±0.05 NPTH:±0.025
Certificate	UL,ISO 9001,ISO14001,IATF16949
Special request	Blind hole+Gold finger + BGA
Material Suppilers	Shengyi, KB, Nanya, ITEQ,etc.