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Industrial Main Control PCBA Immersion Gold FR-4 PCBA Board Assembly

MOQ:	1
支払条件:	T/T
供給能力:	溶接後7000ポイント/日

詳細情報

製品の説明

詳細情報

証明:

ISO, UL, IPC, Reach

層:

18 層

材料:

FR4

厚さ:

2.0mm

ピンスペース:

0.15mm

Min. Component Size:

0201

分穴のサイズ:

0.1mm

組み立てプロセス:

SMT+DIP

応用:

産業用主制御装置

PCBAサービス:

ターンキー組立PCBAサービス

供給の能力:

溶接後7000ポイント/日

ハイライト:

Industrial PCBA immersion gold

FR-4 PCBA board assembly

Main control PCBA industrial

製品の説明

Industrial Main Control PCBA Immersion Gold FR-4 PCBA Board Assembly

What Is Industrial Control PCBA?

Industrial control PCBA (Printed Circuit Board Assembly) is a circuit board assembly designed for industrial automation scenarios, which is equivalent to the "brain" of industrial equipment. It integrates processors (such as ARM, DSP), sensor interfaces, communication modules (such as CAN, EtherCAT), actuator drive circuits, etc., to achieve accurate monitoring and control of industrial production processes (such as mechanical movement, temperature control, data acquisition, etc.).

Industrial Control PCBA Features

High reliability: resistant to high temperature (metallurgy), high humidity (chemical industry), strong interference (motor), MTBF>100,000 hours.
Strong anti-interference: metal shielding, three-proof treatment (waterproof/dustproof/corrosion-proof), optimized wiring, to ensure signal stability.
Functional integration: integrated data acquisition, control, communication and other functions, support multi-device linkage (such as motor + sensor + cloud).
Long life: industrial-grade components (chips/capacitors), suitable for 5-10 years of long-term operation, reducing the need for replacement.

Applications

Manufacturing Automation: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment, etc., to achieve high-precision production.
Robots: Industrial robotic arms, AGV carts, collaborative robots, etc., to control movement and interaction.
Energy and Power: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS), etc.
Petrochemical/Metallurgy: Pumping units, reactor controls, rolling mill equipment, etc., to adapt to high temperature and high pressure environments.

Technical Parameters

PCB Assembly Capability	Normal	Special
SMT Assembly	PCB(used for SMT) specification
Length and Width( L* W)	Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm	L＜2mm L＞1200mm, W＞500mm
Thickness( T)	Thinnest: 0.2mm Thickest: 4mm	T＜0.1mm T＞4.5mm
SMT components specification	Outline Dimension Min size: 0201(0.6mm0.3mm) Max size: 200 125 component thickness: T≤15mm	01005(0.3mm0.2mm) 200 125 6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/ BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification
Length and Width( L* W)	Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm	L＜50mm L≥1200mm, W≥500mm
Thickness( T)	Thinnest: 0.8mm Thickest: 3.5mm	T＜0.8mm T＞2mm