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Haus Produits

Industrial Main Control PCBA Immersion Gold FR-4 PCBA Board Assembly

MOQ:	1
Zahlungsbedingungen:	T/t
Versorgungsfähigkeit:	Nach dem Löten 700.000 Punkte/Tag

Ausführliche Information

Produkt-Beschreibung

Ausführliche Information

Zertifizierung:

ISO, UL, IPC, Reach

Schicht:

18-lagig

Material:

FR4

Dicke:

2,0 mm

Pin-Raum:

0,15 mm

Min. Component Size:

0201

Min. Lochgröße:

0,1 mm

Montageprozess:

SMT+DIP

Anwendung:

Industrielle Hauptsteuerung

PCBA -Dienst:

PCBA-Service für die schlüsselfertige Montage

Versorgungsmaterial-Fähigkeit:

Nach dem Löten 700.000 Punkte/Tag

Hervorheben:

Industrial PCBA immersion gold

FR-4 PCBA board assembly

Main control PCBA industrial

Produkt-Beschreibung

Industrial Main Control PCBA Immersion Gold FR-4 PCBA Board Assembly

What Is Industrial Control PCBA?

Industrial control PCBA (Printed Circuit Board Assembly) is a circuit board assembly designed for industrial automation scenarios, which is equivalent to the "brain" of industrial equipment. It integrates processors (such as ARM, DSP), sensor interfaces, communication modules (such as CAN, EtherCAT), actuator drive circuits, etc., to achieve accurate monitoring and control of industrial production processes (such as mechanical movement, temperature control, data acquisition, etc.).

Industrial Control PCBA Features

High reliability: resistant to high temperature (metallurgy), high humidity (chemical industry), strong interference (motor), MTBF>100,000 hours.
Strong anti-interference: metal shielding, three-proof treatment (waterproof/dustproof/corrosion-proof), optimized wiring, to ensure signal stability.
Functional integration: integrated data acquisition, control, communication and other functions, support multi-device linkage (such as motor + sensor + cloud).
Long life: industrial-grade components (chips/capacitors), suitable for 5-10 years of long-term operation, reducing the need for replacement.

Applications

Manufacturing Automation: Automotive welding/assembly robots, electronic SMT placement machines, food packaging equipment, etc., to achieve high-precision production.
Robots: Industrial robotic arms, AGV carts, collaborative robots, etc., to control movement and interaction.
Energy and Power: Wind power/photovoltaic inverters, power grid monitoring, energy storage battery management (BMS), etc.
Petrochemical/Metallurgy: Pumping units, reactor controls, rolling mill equipment, etc., to adapt to high temperature and high pressure environments.

Technical Parameters

PCB Assembly Capability	Normal	Special
SMT Assembly	PCB(used for SMT) specification
Length and Width( L* W)	Minimum: L≥3mm, W≥3mm Maximum: L≤800mm, W≤460mm	L＜2mm L＞1200mm, W＞500mm
Thickness( T)	Thinnest: 0.2mm Thickest: 4mm	T＜0.1mm T＞4.5mm
SMT components specification	Outline Dimension Min size: 0201(0.6mm0.3mm) Max size: 200 125 component thickness: T≤15mm	01005(0.3mm0.2mm) 200 125 6.5mm＜T≤15mm
QFP,SOP,SOJ (multi pins)	Min pin space: 0.4mm	0.3mm≤Pitch＜0.4mm
CSP/ BGA	Min ball space: 0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification
Length and Width( L* W)	Minimum: L≥50mm, W≥30mm Maximum: L≤1200mm, W≤450mm	L＜50mm L≥1200mm, W≥500mm
Thickness( T)	Thinnest: 0.8mm Thickest: 3.5mm	T＜0.8mm T＞2mm