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High Quality Mobile Phone PCB Production

MOQ:	1
Precio:	Contact us
Condiciones De Pago:	T/T

Información detallada

Descripción de producto

Información detallada

Capa:

Capa 1-64

Material base:

FR4

Espesor:

0.5-10 mm

Espesor de cobre:

0.5-100Z

Tamaño de tablero:

personalizado

Línea anchura mínima/espacio:

0.10/0.10 mm

Tratamiento superficial:

Enig/Oro de inmersión

Certificado:

UL, IATF16949, ISO y Reach

Resaltar:

mobile phone PCB manufacturing

PCB production for smartphones

high-quality PCB assembly

Descripción de producto

High Quality Mobile Phone PCB Production

What's Mobile Phone PCB Production?

Mobile Phone PCB Production is the process of designing and fabricating the printed circuit boards (PCBs) that serve as the backbone of smartphones. It involves several key stages:

Design & Layout: Engineers use specialized software to create a multi-layer schematic that positions components like the processor, memory, and antennas for optimal performance and minimal space usage.
Material Selection: High-performance substrates (e.g., FR-4, polyimide, or advanced low-loss laminates) are chosen based on electrical, thermal, and mechanical requirements, especially for 5G and high-speed signals.
Fabrication:
- A copper-clad laminate is drilled and etched to form fine traces and vias.
- Multiple layers are stacked and bonded to create a compact multilayer board.
- Surface finishes (ENIG, OSP, etc.) are applied to protect copper and enable soldering.
Assembly: Surface-Mount Technology (SMT) places and solders tiny components; through-hole parts are added if needed. Automated optical and X-ray inspections ensure joint quality.
Testing & Integration: Electrical tests, signal-integrity checks, and thermal cycling verify reliability before the PCB is integrated into the phone chassis.

Technical Parameters

Item	Specification
Layers	1~64
Board thickness	0.1mm-10.0mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers
Max panel size	32"×48"(800mm×1200mm)
Min hole size	0.075mm
Min line width	3mil(0.075mm)
Surface finish	OSP, HASL, Imm Gold/Nickel/Ag, Electric gold
Copper thickness	0.5-15 OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Min PAD	5mil(0.13mm)
Inter package	Vacuum
Outer package	Carton
Outline tolerance	±0.75mm
Hole tolerance	PTH:±0.05 NPTH:±0.025
Certificate	UL, ISO 9001, ISO14001, IATF16949
Special request	Blind hole+Gold finger + BGA
Material Suppliers	Shengyi, KB, Nanya, ITEQ, etc.