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8 Layer Fr4 circuit board Manufacturing Service

MOQ:	1
Price:	Contact us
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Layer:

8 Layer

Base Material:

Fr4

Thickness:

0.5 Mm

Copper Thickness:

1.2Z

Board Size:

Customized

Min. Line Width/Space:

0.10/0.10mm

Surface Treatment:

ENIG/Immersion Gold

Certificate:

UL,IATF16949,ISO&Reach

Highlight:

8 layer FR4 PCB manufacturing

FR4 circuit board production service

multilayer PCB fabrication with warranty

Product Description

8 Layer Fr4 Circuit Board Manufacturing Service

What's Printed Circuit Board Manufacturing Service?

Printed Circuit Board Manufacturing Service refers to the professional process of producing Printed Circuit Boards (PCBs) based on customer designs. PCBs are essential components in electronic devices, providing mechanical support and electrical connections for components like resistors, capacitors, and integrated circuits.

What's Fr4?

FR4 (or FR-4) is a glass-fiber-reinforced epoxy-resin laminate. It is the most common substrate used to make rigid printed-circuit boards (PCBs).

Key Features of PCB Manufacturing Service:

Design Submission - Customers provide design files (usually in Gerber format, along with drill files, BOM, and assembly drawings). Engineers review the design for manufacturability (DFM checks).
PCB Fabrication Process:
- Material Selection - Choosing substrate materials (e.g., FR-4, Rogers, flexible PCBs)
- Printing & Etching - Transferring the circuit pattern onto copper-clad laminate
- Layering & Lamination (for multi-layer PCBs)
- Drilling & Plating - Creating vias and through-holes
- Solder Mask & Silkscreen - Applying protective coating and component labels
- Surface Finish - Options like HASL, ENIG, OSP, or immersion silver/gold
- Electrical Testing & Inspection - Ensuring no shorts or open circuits (e.g., flying probe test, AOI)
Additional Services (Optional):
- PCB Assembly (PCBA) - Soldering components onto the board (SMT or through-hole)
- Testing & Quality Control - Functional testing, burn-in testing, etc.
- Box Build & Packaging - Full product assembly

Technical Parameters

Item	Specification
Layers	1~64
Board thickness	0.1mm-10.0mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers
Max panel size	32"×48"(800mm×1200mm)
Min hole size	0.075mm
Min line width	3mil(0.075mm)
Surface finish	OSP, HASL, Imm Gold/Nickel/Ag, Electric gold
Copper thickness	0.5-15 OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Min PAD	5mil(0.13mm)
Inter package	Vacuum
Outer package	Carton
Outline tolerance	±0.75mm
Hole tolerance	PTH:±0.05 NPTH:±0.025
Certificate	UL, ISO 9001, ISO14001, IATF16949
Special request	Blind hole+Gold finger + BGA
Material Suppliers	Shengyi, KB, Nanya, ITEQ, etc.