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RFID Tag High Frequency PCB High Efficiency Signal Transmission PCB Customization
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ Applications of High-Frequency PCB
Communications: including wireless communication equipment such as 5G base stations and wireless routers, as well as satellite communications and navigation systems, to ensure the stability and reliability of signal transmission and achieve high-speed data transmission.
Radar systems: such as weather radars, millimeter-wave radars, etc., to ensure the fast and accurate transmission of high-frequency signals and improve the performance and reliability of radar systems.
Radio frequency identification (RFID) technology: RFID tags used in logistics, warehousing and retail industries to ensure the efficiency of signal transmission and data processing, and to achieve rapid identification and tracking of items.
♦ Technical Parameters
Item |
Specification |
Laers |
1~32 |
Board thickness |
0.1mm-7.0mm |
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
Max panel size |
32"×48"(800mm×1200mm) |
Min hole size |
0.075mm |
Min line width |
3mil(0.075mm) |
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
Copper thickness |
0.5-7.0OZ |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Min PAD |
5mil(0.13mm) |
Inter package |
Vacuum |
Outer package |
Carton |
Outline tolerance |
±0.75mm |
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
Special request |
Blind hole+Gold finger + BGA |
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |