Blackish Green Quick Turn Circuit Boards 2 Layers For Bread Machine OEM

Place of Origin Shenzhen
Brand Name YScircuit
Certification ISO9001,UL,REACH, RoHS
Model Number YS-ML-0003
Minimum Order Quantity 1 piece
Price 0.04-5$/piece
Packaging Details Foam cotton + carton + strap
Delivery Time 2-8 days
Payment Terms T/T,PayPal, Alibaba pay
Supply Ability 251,000 square meter/year

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Product Details
Material FR4 Size 25*35cm
Process Immersion Gold/sliver Surface Finishing HASL/HASL-LF/ENIG/OSP
Color Blackish Green Thickness 0.2cm
Application Bread Machine Name Bread Machine Pcb
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2Layers Quick Turn Circuit Boards

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Blackish Green Quick Turn Circuit Boards

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OEM Quick Turn Circuit Boards

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Product Description

2 Layers Princt Circuit Board Quick Turn Print Bare Boards Pcba Prototype

What is Multilayer PCBs

Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB.

It features layers more than double sided PCB.

 

PCB Sideplating

Sideplating is the metalization of the board edge in the PCB filed.

Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.

 

Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board.

Are indentations created in the form of semi-plated holes on the edges of the PCB boards.

These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.

 

Parameters

  • Layers: 10L multilayer pcb
  • Board Thinkness:2.0mm
  • Base Material:S1000-2 High tg
  • Min Holes:0.2mm
  • Minimum Line Width/Clearance:0.25mm/0.25mm
  • Minimum Clearance between Inner Layer PTH to Line: 0.2mm
  • Size:250.6mm×180.5mm
  • Aspect Ratio:10 : 1
  • Surface treatment:ENIG+ Selective hard gold
  • Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
  • Applications: Wi-Fi modules
YScircuit Bare Boards Normally Delivery Time
layer/m² S<1㎡ S<3㎡ S<6㎡ S<10㎡ S<13㎡ S<16㎡ S<20㎡ S<30㎡ S<40㎡ S<50㎡ S<65㎡ S<85㎡ S<100㎡
1L 4wds 6wds 7wds 7wds 9wds 9wds 10wds 10wds 10wds 12wds 14wds 15wds 16wds
2L 4wds 6wds 9wds 9wds 11wds 12wds 13wds 13wds 15wds 15wds 15wds 15wds 18wds
4L 6wds 8wds 12wds 12wds 14wds 14wds 14wds 14wds 15wds 20wds 25wds 25wds 28wds
6L 7wds 9wds 13wds 13wds 17wds 18wds 20wds 22wds 24wds 25wds 26wds 28wds 30wds
8L 9wds 12wds 15wds 18wds 20wds 20wds 22wds 24wds 26wds 27wds 28wds 30wds 30wds
10L 10wds 13wds 17wds 18wds 20wds 20wds 22wds 24wds 26wds 27wds 28wds 30wds 30wds
12L 10wds 15wds 17wds 18wds 20wds 20wds 22wds 24wds 26wds 27wds 28wds 30wds 30wds
14L 10wds 16wds 17wds 18wds 20wds 20wds 22wds 24wds 26wds 27wds 28wds 30wds 30wds
16L 10wds 16wds 17wds 18wds 20wds 20wds 22wds 24wds 26wds 27wds 28wds 30wds 30wds

 

 

 

YScircuit PCB Fabrication Fastest Expedite Delivery Time
  0-0.5m2 0.5-1m2 1-3m2 3-5m2 5-10m2
1-2L 24H 24H 3wds 4wds 5wds
4L 24H 48H 4wds 5wds 6wds
6L 48H 48H 4wds 6wds 6wds
8L 48H 36H 5wds 6wds 8wds

Blackish Green Quick Turn Circuit Boards 2 Layers For Bread Machine OEM 0

YScircuit PCB Capabilities

Technical index Mass Batch Small batch Sample
Base Material FR4 Normal Tg Shengyi S1141,KB6160(not suitable for lead free process)
Middle Tg For HDI, multi layers: SY S1000H,ITEQIT158.TU-662
High Tg For thick copper, high layer: SY S1000-2;ITEQIT180A;ISOLA:FR408R;370HR;TU-752;
Halogen Free Middle Tg:SYS1150G.H160HF;high Tg: SYS1165
High CTI CTl≥600 SY S1600
High Frequency Rogers,Arion,Taconic,SY SCGA-500.S7136
High Speed SYS7439,TU-862HF.TU-872SLK;ISOLA:l-Speed.1-Tera@MT40;
Flex Materia Base Glue-free:Dupont AK XingyangW-type,Panosonic RF-775;
Coverlay SY SF305C.Xingyang O-type
Special PP No flow PP:VT-447LF.Taiguang 370BL Arion 49N
Ceramic filled adhesive sheetRogers4450F
PTFE adhesive sheetArion6700.Taconic FR-27/FR-28
Double-sided coating PExingyang N-1010TF-mb
Metal Base Berguist Al-base, chaosun Al-base,copperbase
Special High heat resistance rigidity Pl: TenghuiVT-901.Arion85N.SY S260(Tg250)
High thermal conductivty material: 92ML
Pure ceramic matenal: alumna ceramic.Aluminum nitride ceramics
BT material: Taiwan Nanya NGP-200WT
Layers FR4 20 36 48
Rigid8Flex/(Flex) 16(6) 16(6) 24(6)
High Frequency Mixed Lamination 12 12 20
100% PTFE 6 6 10
HDI 4 steps 4 steps 4 steps
Technical lndex Mass Batch Small Batch Sample
Delivery Size Max(mm) 1200*560 1200*560 1200*560
(mm) Min(mm) 20*20 10"10 5*10
Finish board thickness Max(mm) 10    
Min(mm) 0.3    
Width/Gap Inner(mil) 0.5OZ base cooper: 3/3 1.0OZ base copper: 4/42.0OZ base copoer: 516
3.0OZ base cooper: 7/9 4.0OZ base copper: 8/12 5.0OZ base copper: 10/15
6.0OZ basecooper: 12/18 10OZ basecopper: 18/24 12OZ base copper: 20/28
Outer (mil) 1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5
2.0OZ base cooper: 6/8 3.0OZ base copper: 7/10 4.0OZ base copper: 8/13
5.0OZ base cooper: 10/16 6.0OZ base copper: 12/18 10OZ base copper:18/24
12OZ base copper: 20/28150Z base copper: 24/32
Line Width
Tolerance
>5.0 mil ±20% ±20% ±1.0mil
≤5.0 mil ±1.0mil ±1.0mil ±1.0mil
Drilling Min laser(mm) 0.1 0.1 0.1
Min CNC(mm) 0.2 0.15 0.15
Max CNC drill bit (mm) 6.5 6.5 6.5
Min Half Hole(mm) 0.5 0.4 0.4
PTH Hole(mm) Normal ±0.1 ±0.075 ±0.075
Pressing Hole ±0.05 ±0.05 ±0.05
Hole Angle(conical) Width of upper diameters≤6.5mm:800,900,1000,1100:Width of upper diameters≤65mm:900;
Frecision of Depth-control Drilling (mm) ±0.10 ±0.075 ±0.05
Number of blind CNC holes of one sidd ≤2 ≤3 ≤4
Minimum via hole spacing (different network, military, medical, automobile )mm 0.5 0.45 0.4
Minimum via spacing(different network, general industrial control and consumer electronic ) mm 0.4 0.35 0.3

 

 

YScircuit Print Circuit Boards Production Process

流程图

 

 

PCB Stack UP

How to makes a good PCB Stack-Up? - News-Blog - Headpcb--Professional PCB  Service Provider

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FQA

 

1. What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.

 

2. What is hard gold plating?
Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure.

The most common alloying elements used in hard gold plating are cobalt, nickel or iron.

 

3. What is the difference between Enig and hard gold?
ENIG plating is much softer than hard gold plating.

Grain sizes are about 60 times larger with ENIG plating, and hardness runs between 20 and 100 HK25.

ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.

 

A popular trend among manufacturers is board-to-board soldering.

This technique allows companies to produce integrated modules (often containing dozens of parts) on a single board that can be built into another assembly during production.

One easy way to produce a PCB that is destined to be mounted to another PCB is to create castellated mounting holes.

These are also known as "castellated vias" or "castellations."