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OEM and ODM 4 Layer PCB Board Multilayer Circuit Board Assembly

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Τιμή:	Contact us
Όροι πληρωμής:	T/t

Πληροφορίες λεπτομέρειας

Περιγραφή προϊόντων

Πληροφορίες λεπτομέρειας

Στρώμα:

1-64 Επίπεδα

Βασικό υλικό:

Ρότζερς

Πάχος:

00,5-10,0 mm

Πάχος χαλκού:

0.5-15ΟZ

Μέγεθος σκάφους:

προσαρμοσμένος

Ελάχιστα πλάτος/διάστημα γραμμών:

0.10/0.10mm

Επιφανειακή επεξεργασία:

ENIG/Χρυσός Εμβάπτισης

Πιστοποιητικό:

UL, IATF16949, ISO & REACH

Επισημαίνω:

4 layer PCB board assembly

multilayer circuit board manufacturing

EM ODM PCB assembly

Περιγραφή προϊόντων

OEM and ODM 4 Layer PCB Board Multilayer Circuit Board Assembly

What's 4 Layer PCB?

A 4-layer PCB is a type of multilayer printed circuit board that consists of four conductive copper layers laminated together with insulating material (typically FR-4). These layers are interconnected through vias (plated holes) to form a complete circuit.

Structure of a 4-Layer PCB:

A standard 4-layer PCB stack-up usually includes:

Top Layer (Signal Layer) - Contains component footprints and signal traces.
Inner Layer 1 (Ground Plane, GND) - Provides a low-impedance return path for signals and reduces EMI.
Inner Layer 2 (Power Plane, VCC) - Distributes power efficiently across the board.
Bottom Layer (Signal Layer) - Additional routing space for signals and components.

Technical Parameters

Item	Specification
Layers	1~64
Board thickness	0.1mm-10.0mm
Material	FR-4,CEM-1/CEM-3,PI,High Tg,Rogers
Max panel size	32"×48"(800mm×1200mm)
Min hole size	0.075mm
Min line width	3mil(0.075mm)
Surface finish	OSP,HASL,Imm Gold/Nickel/Ag, Electric gold
Copper thickness	0.5-15 OZ
Soldermask	Green/Yellow/Black/White/Red/Blue
Silkscreen	Red/Yellow/Black/White
Min PAD	5mil(0.13mm)
Inter package	Vacuum
Outer package	Carton
Outline tolerance	±0.75mm
Hole tolerance	PTH:±0.05 NPTH:±0.025
Certificate	UL,ISO 9001,ISO14001,IATF16949
Special request	Blind hole+Gold finger + BGA
Material Suppilers	Shengyi, KB, Nanya, ITEQ,etc.