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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

MOQ:	1
Price:	Inquiry Us
Payment Terms:	T/T
Supply Ability:	200,000+ m² PCB per Month

Detail Information

Product Description

Detail Information

Layer:

12 Layers

Material:

Tg170

Board Thickness:

1.8mm

Construction:

3+4+3

Min. Line Width/Space:

0.1/0.1mm

Surface Treatment:

Immersion Gold

Color:

Green

Application:

Wearable Devices

Standard:

UL&IPC Standard &ISO

Supply Ability:

200,000+ m² PCB per Month

Highlight:

ODM tg170 pcb

Multilayer tg170 pcb

ODM fr4 tg 170

Product Description

Tg170 Multilayer Board(3+4+3) HDI PCB Wearable Devices

♦ What is HDI PCB?

HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.

♦ Characteristics of HDI PCB

- High circuit density
- Miniaturization and thinness
- Excellent signal integrity
- Good heat dissipation performance
- High reliability
- A variety of laminate structures are available

♦ Applications of HDI PCB

Widely used in fields with high requirements on circuit board size, performance and reliability, such as smart phones, tablet computers, laptops, automotive electronics, medical equipment, aerospace, communication equipment, etc.

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

Tags:


PCB Prototype	Felx PCB	Rigid-Flex PCB	Ceramic PCB

Heavy Copper PCB	HDI PCB	High Frequency PCB	High TG PCB

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