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Tg170 Multilayer Board(3+4+3) HDI PCB Wearable Devices
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.
♦ Characteristics of HDI PCB
♦ Applications of HDI PCB
Widely used in fields with high requirements on circuit board size, performance and reliability, such as smart phones, tablet computers, laptops, automotive electronics, medical equipment, aerospace, communication equipment, etc.
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |