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Red Rigid-Flex PCB Bendable 3D Wiring for Smart Electronic Devices
♦ What is Rigid-Flex PCB?
Rigid-Flex PCB is a composite structure circuit board that combines a rigid printed circuit board (PCB) and a flexible circuit board (FPC). It is mainly composed of two parts: rigid and flexible. The rigid layer is made of traditional PCB materials (such as FR-4), providing stable electrical performance and mechanical strength; the flexible layer is made of flexible circuit materials such as polyimide or polyester, which has high bending and folding resistance; the two are connected by special adhesives or welding processes.
♦ Features of Rigid-Flex PCB
Flexible structure: some areas are rigid, providing stable support; some areas are flexible, can be bent, folded or dynamically moved, and adapt to complex space layout.
Space saving: reducing the use of connectors, cables and connectors, making the product structure more compact, suitable for portable devices, medical devices and other products with high space requirements.
Improve reliability: reduce the number of connection points, reduce the risk of failures such as poor contact and broken wires, and improve product stability and service life.
♦ Applications of Rigid-Flex PCB
Consumer electronics: smartphones (internal connections of folding screens), wearable devices (circuits inside smartwatch straps), tablet computers (circuit boards at hinges);
Industrial and medical: industrial sensors (detection modules that need to be bent and installed), medical implants (internal circuits of pacemakers), avionics equipment (control modules that need to resist vibration);
Automobile and transportation: battery management systems for new energy vehicles (BMS, adapted to complex battery pack layouts), on-board displays (foldable or curved screen connections), autonomous driving sensors (dynamic bending requirements);
Military and aerospace: satellite communication equipment (needs to be lightweight and radiation-resistant), aircraft control circuit boards (adaptable to high-vibration environments).
♦ Technical Parameters