Red Rigid Flex Bendable Wiring 3D Circuit Board PCB For Smart Electronic Devices

Red Rigid-Flex PCB Bendable 3D Wiring for Smart Electronic Devices

♦ What is Rigid-Flex PCB?

Rigid-Flex PCB is a composite structure circuit board that combines a rigid printed circuit board (PCB) and a flexible circuit board (FPC). It is mainly composed of two parts: rigid and flexible. The rigid layer is made of traditional PCB materials (such as FR-4), providing stable electrical performance and mechanical strength; the flexible layer is made of flexible circuit materials such as polyimide or polyester, which has high bending and folding resistance; the two are connected by special adhesives or welding processes.

♦ Features of Rigid-Flex PCB

• • Flexible structure: some areas are rigid, providing stable support; some areas are flexible, can be bent, folded or dynamically moved, and adapt to complex space layout.

  • Space saving: reducing the use of connectors, cables and connectors, making the product structure more compact, suitable for portable devices, medical devices and other products with high space requirements.

  • Improve reliability: reduce the number of connection points, reduce the risk of failures such as poor contact and broken wires, and improve product stability and service life.

♦ Applications of Rigid-Flex PCB

• • ​​Consumer electronics​​: smartphones (internal connections of folding screens), wearable devices (circuits inside smartwatch straps), tablet computers (circuit boards at hinges);

  • Industrial and medical​​: industrial sensors (detection modules that need to be bent and installed), medical implants (internal circuits of pacemakers), avionics equipment (control modules that need to resist vibration);

  • Automobile and transportation​​: battery management systems for new energy vehicles (BMS, adapted to complex battery pack layouts), on-board displays (foldable or curved screen connections), autonomous driving sensors (dynamic bending requirements);

  • ​Military and aerospace​​: satellite communication equipment (needs to be lightweight and radiation-resistant), aircraft control circuit boards (adaptable to high-vibration environments).

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm)  Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

 

 

 

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