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High-performance Substrate Polyimide Thick Copper PCB Multilayer Copper Stacked PCB Board
♦ What is Thick copper PCB?
Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.
♦ Features of Thick Copper PCB
Large current carrying capacity: copper thickness ≥3oz, can pass 100A+ current, low temperature rise.
Strong heat dissipation: high thermal conductivity, heat dissipation efficiency increased by 5 times+, temperature rise reduced by 10-15℃.
High mechanical strength: bending resistance increased by 50%, high temperature vibration resistance, adaptable to harsh environments.
Electrical stability: low impedance, low loss, low risk of delamination at high temperature.
Flexible design: supports wide line width (≥100mil) and multi-layer thick copper stacking.
Complex process: etching/drilling is difficult, yield rate is 85%-90%.
High cost: material + processing premium is 30%-50%, and the unit price is high.
♦ Applications of Thick Copper PCB
♦ Technical Parameters
Item |
Specification |
Laers |
1~32 |
Board thickness |
0.1mm-7.0mm |
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
Max panel size |
32"×48"(800mm×1200mm) |
Min hole size |
0.075mm |
Min line width |
3mil(0.075mm) |
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
Copper thickness |
0.5-7.0OZ |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Min PAD |
5mil(0.13mm) |
Inter package |
Vacuum |
Outer package |
Carton |
Outline tolerance |
±0.75mm |
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
Special request |
Blind hole+Gold finger + BGA |
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |