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PCB Manufacturing
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Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

MOQ: 1
Price: Inquiry Us
Payment Terms: T/T
Detail Information
Layer:
4 Layer
Board Thickness:
0.8m
Board Material:
Polyimide (PI)
Finished Copper:
0.5 OZ
Min Line Width/Spacing:
0.1/0.1mm
Surface Finish:
ENIG
Application:
Portable Devices
Certificate:
UL,IATF16949,ISO&Reach
Highlight:

Polyimide rigid flex pcb fabrication

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ENIG rigid flex pcb fabrication

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Polyimide 4 layer circuit board

Product Description

4 Layer PCB Flexible Board for Medical Device

 

What is 4 Layer PCB?

 

A ​​4-layer PCB​​ is a printed circuit board with ​​four conductive copper layers​​ stacked together with insulating (dielectric) material in between. These layers are interconnected through ​​vias​​ (plated holes) to create complex circuits while saving space and improving performance compared to single or double-sided boards.

 

Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device 0 Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device 1 Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device 2

 

♦ Structure of a 4-Layer PCB​

 

A typical 4-layer stackup consists of:

    1. ​​Top Layer (Signal Layer)​​ – Contains component placements and high-speed signal traces.
    2. ​​Inner Layer 1 (Ground Plane)​​ – Acts as a reference plane for EMI shielding and noise reduction.
    3. ​​Inner Layer 2 (Power Plane)​​ – Distributes stable power supply to components.
    4. ​​Bottom Layer (Signal Layer)​​ – Additional routing space for signals and components.

 

♦ ​​4-Layer PCB vs. 2-Layer PCB​​

Feature 4-Layer PCB 2-Layer PCB
​Layers​ 4 (Signal+GND+PWR) 2 (Top+Bottom)
​Routing Space​ ✅ High ❌ Limited
​Signal Noise​ ✅ Low (GND plane) ❌ Higher
​EMI Shielding​ ✅ Better ❌ Poor
​Cost​ ⚠️ Higher (~2x) ✅ Lower

 

♦ ​​Manufacturing Process​​

    1. ​Design​​ – Use CAD tools (Altium, KiCad) to define layer stackup and routing.
    2. ​Material Selection​​ – Choose core/prepreg materials (FR-4, Rogers).
    3. ​Lamination​​ – Bond layers under heat/pressure.
    4. ​Drilling & Plating​​ – Create vias for inter-layer connections.
    5. ​Etching​​ – Remove excess copper to form traces.
    6. ​Testing​​ – Verify continuity, impedance, and shorts.

 

♦ Technical Parameters

 

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm)  Advance: 2mil

Board Outline Tolerance

0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

 

 

 

One-Stop PCBs Solution

 

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Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production