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High Frequency Reliable Thick Copper PCB Black Board for Power Module
♦ What is Thick copper PCB?
Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.
♦ Features of Thick Copper PCB
♦ Applications of Thick Copper PCB
♦ Special structure in thick copper PCB design
Copper-based sandwich design:A copper-based heat dissipation layer (such as copper bricks or copper foil stacking) is embedded in the traditional FR-4 substrate to form a "sandwich" structure, which increases the local heat dissipation capacity by 3 times and is used for direct installation of IGBT modules.
Step-type copper thickness design:Different copper thicknesses are used in different areas on the same PCB (such as 8oz in the power area and 1oz in the signal area) to balance the current carrying and signal integrity requirements. Copper layer partitioning needs to be achieved by laser cutting or milling.
♦ Technical Parameters
Item |
Specification |
Laers |
1~32 |
Board thickness |
0.1mm-7.0mm |
Material |
FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
Max panel size |
32"×48"(800mm×1200mm) |
Min hole size |
0.075mm |
Min line width |
3mil(0.075mm) |
Surface finish |
OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
Copper thickness |
0.5-7.0OZ |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Min PAD |
5mil(0.13mm) |
Inter package |
Vacuum |
Outer package |
Carton |
Outline tolerance |
±0.75mm |
Hole tolerance |
PTH:±0.05 NPTH:±0.025 |
Certificate |
UL,ISO 9001,ISO14001,IATF16949 |
Special request |
Blind hole+Gold finger + BGA |
Material Suppilers |
Shengyi, KB, Nanya, ITEQ,etc. |