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PCB Manufacturing
Created with Pixso.

odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly

odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly

MOQ: 1
Price: Contact us
Payment Terms: T/T
Detail Information
Layer:
1-64 Layer
Base Material:
FR4
Thickness:
0.5-10.0mm
Copper Thickness:
0.5-15OZ
Board Size:
Customized
Min. Line Width/Space:
0.10/0.10mm
Surface Treatment:
ENIG/Immersion Gold
Certificate:
UL,IATF16949,ISO&Reach
Highlight:

odm circuit board fabrication

,

Low Volume circuit board fabrication

,

odm low volume pcb assembly

Product Description

Multilayer PCB Manufacturing Printed Circuit Board for Electronic Products with CE

 

 

What's Multilayer PCB?

 

A ​​Multilayer PCB (Printed Circuit Board)​​ is a type of circuit board that consists of ​​three or more conductive copper layers​​, laminated together with insulating (dielectric) material to form a single structure. These layers are interconnected through ​​vias​​ (plated holes), allowing complex circuitry in a compact space.

 

odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 0 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 1 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 2

 

 

♦ ​​Key Features of Multilayer PCBs:​​

    • ​Multiple Layers​​ (typically 4, 6, 8, up to 50+ in advanced designs).
    • ​Stacked Construction​​: Layers are bonded under heat and pressure.
    • ​Inner Layers​​: Used for power/ground planes or signal routing.
    • ​Vias​​: Plated holes (through-hole, blind, or buried) connect different layers.
    • ​High Density​​: Supports complex circuits in a small footprint.

 

♦ Comparison with Single/Double-Layer PCBs:​

  •  
Feature Single-Layer Double-Layer Multilayer
​Layers​ 1 (Top) 2 (Top + Bottom) 3+ (Multiple inner layers)
​Complexity​ Low Medium High
​Cost​ Low Moderate Higher
​Use Case​ Simple circuits Moderate complexity High-speed, dense designs

 

 

Technical Parameters

 

Item

Specification

Laers

1~64

Board thickness

0.1mm-10.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-15 OZ

Soldermask

Green/Yellow/Black/White/Red/Blue 

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger  + BGA

Material Suppilers

 Shengyi, KB, Nanya, ITEQ,etc.

 
 
 
One-Stop PCBs Solution

 

odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 3 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 4 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 5 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 6
PCB Prototype Felx PCB  Rigid-Flex PCB Aluminium PCB
odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 7 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 8 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 9 odm PCB Printed Circuit Board Fabrication Manufacturing Low Volume Assembly 10
Heavy Copper PCB HDI PCB High Frequency PCB  High TG PCB

 

 
 
 
Advantages of DQS Team
  1. On-time Delivery:  
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines 
    • 4 DIP assembly lines

 

     2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards 
    • Online SPI, AOI, X-Ray Inspection 
    • The qualified rate of products reach 99.9%

 

     3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production