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0.2mm Thick Flexible PCB High and Low Temperature Resistance High Integration
♦ What is Flexible PCB
Flexible PCB (FPC), also called a "soft board" or flexible circuit, is a type of printed circuit board (PCB) made from flexible insulating materials, such as polyimide (PI) or polyester (PET), instead of rigid fiberglass (FR4). This unique construction allows FPCs to bend, fold, and twist without breaking, enabling compact, lightweight, and space-saving designs in modern electronics.
♦ Advantages of FPC
Signal stability: reduce transmission interference and ensure high-speed data transmission.
High integration: dense arrangement of circuits and components, integrated functions.
Flexible design: support special-shaped layout and shorten the development cycle.
Cost controllable: reduce assembly process and material consumption.
Environmental adaptability: high and low temperature resistance, vibration resistance, and electromagnetic interference resistance.
♦ Difficulties in Flexible PCB Manufacturing
Base material is fragile: PI film is thin and easy to wrinkle and crack, low-tension precision processing is required.
Micro-line is difficult to control: micron-level line width/spacing, electroplating and hole filling are prone to defects.
Strict alignment: multi-layer lamination requires high precision, and offset affects yield.
Surface sensitivity: The plating needs to balance flexibility and conductivity, and the process window is narrow.
Complex detection: internal line defects are difficult to detect, relying on expensive equipment such as X-ray.
♦ Applications of Flexible PCB
Smartphones & Wearables (foldable screens, flexible displays);
Laptops & Tablets (hinge connections, battery flex cables);
Automotive Electronics (sensors, lighting, dashboard controls);
Medical Devices (implantable electronics, diagnostic equipment);
Aerospace & Defense (lightweight, high-reliability circuits).
♦ Technical Parameters
Item |
Spec |
Layers |
1~64 |
Board Thickness |
0.1mm-10 mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size |
800mm×1200mm |
Min Hole Size |
0.075mm |
Min Line Width/Space |
Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
17um--175um |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
17:01 |
Solder Mask Type |
LPI |
SMT Min. Solder Mask Width |
0.075mm |
Min. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |