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ODM 12 Layer Fast Turnaround PCBA Assy Printed Circuit Board for Automobile

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Detail Information

Product Description

Detail Information

Layer:

12 L

Min. Component Size:

0201

Board Thickness:

2.5mm

Surface Finish:

ENIG

Pin Space:

0.1mm

Application:

EV Battery Management (BMS)

Highlight:

12 Layer pcba assy

Fast Turnaround pcba assy

ODM fast turnaround pcb assembly

Product Description

12 Layer Automotive PCBA for EV Battery Management (BMS)

♦ What is Automotive PCBA for EV Battery Management (BMS)??

Automotive PCBA (Printed Circuit Board Assembly) for EV Battery Management Systems (BMS) refers to the specialized electronic assemblies that monitor, control, and optimize the performance, safety, and lifespan of lithium-ion (or other) battery packs in electric vehicles (EVs).

♦ Key Functions of BMS PCBA in EVs:

1. Voltage & Current Monitoring

- Measures individual cell voltages (e.g., 96+ cells in a Tesla pack).
- Tracks charge/discharge current for State of Charge (SOC) estimation.

2. Temperature Sensing & Thermal Management

- Uses NTC/PTC thermistors to detect overheating.
- Triggers cooling systems (liquid/air) to prevent thermal runaway.

3. Cell Balancing (Active/Passive)

- Passive Balancing: Burns excess energy via resistors (cheaper, less efficient).
- Active Balancing: Transfers energy between cells (higher efficiency).

4. Fault Protection & Safety

- Prevents:
  - Overcharge (can cause fire)
  - Over-discharge (reduces battery life)
  - Short circuits (isolates faulty cells)

5. Communication & Data Logging

- - CAN bus / LIN bus communication with the vehicle’s ECU.
  - Stores historical data for diagnostics (e.g., Tesla’s battery logs).

♦ BMS PCBA Design & Components:

Component	Role in BMS	Example Parts
Microcontroller (MCU)	Brain of BMS (runs algorithms)	NXP S32K, TI Hercules, STM32
AFE (Analog Front End)	Measures cell voltages	Texas Instruments BQ76PL536, LTC6811
Isolation ICs	Protects high-voltage circuits	Silicon Labs Si823x, ADuM4160
Current Sensor	Measures pack current	Hall-effect sensors (Allegro ACS712), Shunt resistors
MOSFETs/Relays	Controls charge/discharge	Infineon OptiMOS, TE Connectivity relays
Communication ICs	CAN/LIN transceivers	NXP TJA1042, Microchip MCP2562

♦ Types of Automotive PCB Assemblies:

Application	PCB Requirements	Examples
Engine Control Unit (ECU)	High-temperature resistance, EMI shielding	Fuel injection, ignition timing
Infotainment System	High-speed signal integrity, multilayer	Touchscreens, GPS, Bluetooth
ADAS (Radar/LiDAR)	RF/microwave PCBs, low-loss materials	Collision avoidance, adaptive cruise control
EV Battery Management (BMS)	High-current PCBs, thermal management	Cell balancing, charge monitoring
LED Lighting	Aluminum PCBs for heat dissipation	Headlights, interior lightin

♦ DQS's PCB Assembly Capability

Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

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