DQS Electronic Co., Limited
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국

products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Automotive PCBA
Created with Pixso.

ODM 12 Layer Fast Turnaround PCBA Assy Printed Circuit Board for Automobile

ODM 12 Layer Fast Turnaround PCBA Assy Printed Circuit Board for Automobile

MOQ: 1
Price: Contact our PCB engineer
Payment Terms: T/T
Detail Information
Layer:
12 L
Min. Component Size:
0201
Board Thickness:
2.5mm
Surface Finish:
ENIG
Pin Space:
0.1mm
Application:
EV Battery Management (BMS)​​
Highlight:

12 Layer pcba assy

,

Fast Turnaround pcba assy

,

ODM fast turnaround pcb assembly

Product Description

12 Layer Automotive PCBA for EV Battery Management (BMS)​​

 

 

♦ What is Automotive PCBA for EV Battery Management (BMS)?

 

Automotive PCBA (Printed Circuit Board Assembly) for EV Battery Management Systems (BMS)​​ refers to the specialized electronic assemblies that monitor, control, and optimize the performance, safety, and lifespan of lithium-ion (or other) battery packs in electric vehicles (EVs).

 

 

♦ Key Functions of BMS PCBA in EVs:

1. Voltage & Current Monitoring​​

    • Measures individual cell voltages (e.g., 96+ cells in a Tesla pack).
    • Tracks charge/discharge current for ​​State of Charge (SOC)​​ estimation.

​​2. Temperature Sensing & Thermal Management​​

    • Uses ​​NTC/PTC thermistors​​ to detect overheating.
    • Triggers cooling systems (liquid/air) to prevent thermal runaway.

​​3. Cell Balancing (Active/Passive)​​

    • ​​Passive Balancing:​​ Burns excess energy via resistors (cheaper, less efficient).
    • ​​Active Balancing:​​ Transfers energy between cells (higher efficiency).

​​4. Fault Protection & Safety​​

    • Prevents:
      • ​​Overcharge​​ (can cause fire)
      • ​​Over-discharge​​ (reduces battery life)
      • ​​Short circuits​​ (isolates faulty cells)

​​5. Communication & Data Logging​​

      • ​​CAN bus / LIN bus​​ communication with the vehicle’s ECU.
      • Stores historical data for diagnostics (e.g., Tesla’s battery logs).

 

♦ BMS PCBA Design & Components:

​Component​ ​Role in BMS​ ​Example Parts​
​Microcontroller (MCU)​ Brain of BMS (runs algorithms) NXP S32K, TI Hercules, STM32
​AFE (Analog Front End)​ Measures cell voltages Texas Instruments BQ76PL536, LTC6811
​Isolation ICs​ Protects high-voltage circuits Silicon Labs Si823x, ADuM4160
​Current Sensor​ Measures pack current Hall-effect sensors (Allegro ACS712), Shunt resistors
​MOSFETs/Relays​ Controls charge/discharge Infineon OptiMOS, TE Connectivity relays
​Communication ICs​ CAN/LIN transceivers NXP TJA1042, Microchip MCP2562

 

♦ Types of Automotive PCB Assemblies:

 

​​Application​​ ​​PCB Requirements​​ ​​Examples​​
​​Engine Control Unit (ECU)​​ High-temperature resistance, EMI shielding Fuel injection, ignition timing
​​Infotainment System​​ High-speed signal integrity, multilayer Touchscreens, GPS, Bluetooth
​​ADAS (Radar/LiDAR)​​ RF/microwave PCBs, low-loss materials Collision avoidance, adaptive cruise control
​​EV Battery Management (BMS)​​ High-current PCBs, thermal management Cell balancing, charge monitoring
​​LED Lighting​​ Aluminum PCBs for heat dissipation Headlights, interior lightin

 

 

 

♦ DQS's PCB Assembly Capability

 

 

Item

 

Normal

 

 Special

 

 

 

 

 

 

 

 

SMT

Assembly

 

 

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm,  W≥3mm

L<2mm

Maximum

L≤800mmW≤460mm

L > 1200mmW>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

 

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

   Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

 

 

DIP

Assembly

 

PCB specification

 

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mmW≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

     T>2mm